Semiconductor Package Sidewall Geometry for Precise Die Singulation
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Solution Overview
Problem
The semiconductor industry faces challenges in creating smaller and more efficient packaging techniques for semiconductor dies, particularly in Package-on-Package (PoP) technology, where integrating multiple dies with high density and functionality while maintaining structural integrity and ease of processing is crucial.
Innovation Solution
A method involving the use of a flexible and durable insulating layer with specific chemical properties, such as polyimide, is applied to semiconductor dies, which can be efficiently removed during processing, allowing for precise singulation and integration into a semiconductor package with a redistribution structure, enhancing adhesion and reducing damage during handling and encapsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional packaging techniques are used for semiconductor dies, then structural integrity can be maintained, but integration density and device size increase
Solution Approach 1:
The patent implements Package-on-Package (PoP) technology where a first package component containing a semiconductor die is stacked vertically on a second package component, enabling nested arrangement of multiple functional units in three-dimensional space. This nesting approach achieves high integration density while maintaining compact device footprint on the printed circuit board
2Strength
If insulating layers are used during processing, then adhesion and structural integrity are improved, but processing time and complexity increase
Solution Approach 1:
The patent applies an insulating layer to the semiconductor die before packaging operations, performing the adhesion enhancement action in advance. This preliminary application of insulating material ensures proper adhesion during subsequent stacking and encapsulation processes without adding complex sequential steps
Solution Approach 2:
The patent modifies material parameters by selecting specific insulating materials with appropriate dielectric properties and adhesion characteristics. By changing the material parameters of the insulating layer, the process achieves both structural integrity and streamlined processing
3Adaptability or versatility
If multiple semiconductor dies are integrated in PoP structure, then functionality is enhanced, but structural integrity and alignment precision become more difficult to maintain
Solution Approach 1:
The patent introduces package components with redistribution structures as intermediary elements between stacked semiconductor dies. These intermediary package layers provide mechanical support, electrical redistribution, and alignment reference features that facilitate precise positioning of multiple dies in the vertical stacking configuration
Data Source
AI summary
A package and a method forming the same are provided. The package includes an integrated circuit die. A sidewall of the integrated circuit die has a first facet and a second facet. The first facet and the second facet have different slopes. The package includes an encapsulant surrounding the integrated circuit die and in physical contact with the first facet and the second facet and an insulating layer over the integrated circuit die and the encapsulant. An upper surface of the integrated circuit die is lower than an upper surface of the encapsulant. A sidewall of the insulating layer is substantially coplanar with the first facet.