Semiconductor Package Socket for Replaceable HBM Inspection
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Solution Overview
Problem
In semiconductor packages, replacing a defective high bandwidth memory (HBM) chip is difficult, leading to yield deterioration and increased costs due to the need to replace the entire product, and characterizing HBM at the package and board levels is challenging.
Innovation Solution
A semiconductor package design with sockets and socket pins allows for easy replacement and electrical inspection of semiconductor chips at the package and board levels, using substrates and sockets to facilitate connection and detachment of chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If HBM chip is directly mounted on interposer substrate in 2.5D package, then high bandwidth memory performance is achieved, but replacement of defective chip becomes difficult and entire product must be replaced
Solution Approach 1:
The patent segments the HBM chip mounting structure by introducing a separate socket component that can be independently removed from the interposer substrate. The socket body is divided into a mounting region for the chip and a body region, allowing the chip to be accessed and replaced without removing the entire package assembly.
Solution Approach 2:
The patent introduces a socket as an intermediary component between the HBM chip and the interposer substrate. This socket acts as a mediator that provides both mechanical support and electrical connection, while enabling easy chip replacement through its removable design.
2Reliability
If HBM chip is permanently attached to interposer, then electrical connection stability is improved, but electrical inspection at package and board levels becomes difficult
Solution Approach 1:
The patent makes the electrical connection dynamic by designing the socket with removable contacts that can establish or disconnect electrical pathways. The first and second contacts can be positioned to connect or disconnect from the HBM chip, enabling electrical inspection modes.
Solution Approach 2:
The patent incorporates preliminary inspection features by including test contact structures within the socket that can establish electrical connections for inspection purposes before the chip is permanently installed or during the installation process.
3Ease of repair
If socket structure with multiple contacts is used for easy chip replacement, then chip replacement ease is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple functions into the socket structure: mechanical support, electrical connection, and inspection capability are all integrated into a single socket component rather than requiring separate structures for each function.
Solution Approach 2:
The socket is designed as a universal component that performs multiple functions: it provides mechanical mounting for the HBM chip, establishes electrical connections through its contacts, and enables electrical inspection through its test contact structures.
Data Source
AI summary
The present disclosure provides a semiconductor package including: a substrate; a socket on the substrate and including a socket body having a mounting region on which a first semiconductor chip is mounted and socket pins penetrating the socket body and electrically connected to the substrate; and one or more second semiconductor chips disposed side by side on the substrate adjacent the socket.