Semiconductor Package Stacked Chip Thermal Dissipation
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Solution Overview
Problem
In semiconductor packages, the heat generated by system chips can cause thermal damage to memory chips due to poor heat dissipation, especially in densely integrated systems where space constraints limit the effectiveness of heat sinks, hindering the miniaturization and integration of semiconductor packages.
Innovation Solution
A semiconductor package design featuring a first semiconductor chip with an opening for a second chip, allowing for improved heat dissipation by increasing the overlap area with a heat sink and reducing local thermal damage, while maintaining a compact form factor through a substrate with connection pads and connection members like bumps and wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink is used to alleviate thermal damage, then heat dissipation is improved, but the overlap area between the system chip and the heat sink decreases due to high degree of integration, making heat dissipation effect poor
Solution Approach 1:
The patent transitions from a planar arrangement to a three-dimensional stacked architecture. The memory chip is positioned vertically above the system chip in a stacked configuration, utilizing the Z-dimension (vertical space) rather than horizontal plane. This dimensional change allows the memory chip to be located directly over the heat-generating region, maximizing thermal coupling with the heat sink attached to the system chip's backside, thereby improving heat dissipation without requiring additional horizontal overlap area.
Solution Approach 2:
The patent implements a nested structure where the memory chip is placed within the vertical projection area of the system chip. The memory chip sits in the space directly above the system chip, effectively nesting the components in the vertical dimension. This nesting arrangement ensures that the memory chip is positioned in the region of highest heat flux from the system chip, maximizing passive thermal management while maintaining compact form factor.
2Volume of moving object
If the size of a semiconductor chip decreases, then miniaturization is achieved, but the size of a semiconductor package cannot be decreased to achieve high degree of integration
Solution Approach 1:
The patent resolves the contradiction between chip size reduction and integration density by moving from two-dimensional lateral arrangement to three-dimensional vertical stacking. Multiple functional blocks (system chip, memory chip, heat sink) are arranged in the vertical dimension, allowing high degree of integration within a compact package footprint. This stacked architecture enables more functionality to be packed into a smaller overall package size while maintaining individual chip dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces thermal damage to memory chips by enhancing heat dissipation and increasing the degree of integration, enabling smaller, more efficient semiconductor packages suitable for miniaturized electronic products.
Implementation Method 1
heat generated by a system chip may damage a memory chip... heat dissipation effect becomes poor
Implementation Method 2
heat sink can be used to alleviate thermal damage
Data Source
AI summary
A semiconductor chip includes a body part having a first surface and a second surface facing away from the first surface, and an opening passing from the first surface to the second surface of the body part.