Semiconductor Package Static Protection Conductive Seal
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Solution Overview
Problem
Wide gap semiconductor devices, such as those using Gallium Nitride (GaN) and silicon carbide (SiC), have lower resistance to static electricity compared to silicon semiconductor devices, and existing solutions like external Zener diodes increase cost and parasitic capacitance, making them prone to static electricity damage before mounting.
Innovation Solution
Incorporating a conductive body with a resistance of 150Ω or less, which is contactable with leads and can be easily removed, providing a conductive seal that short-circuits the semiconductor device's electrodes, thereby protecting against static electricity without the need for external components and maintaining low cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an external protective circuit (Zener diode) is installed with the semiconductor package, then the resistance to static electricity is improved, but the cost and device complexity increase
Solution Approach 1:
The patent combines the protective function with the existing resin seal structure by incorporating conductive particles into the resin. This merges the mechanical sealing function with the electrostatic protection function into a single integrated component, eliminating the need for separate protective circuits and reducing overall device complexity while maintaining static electricity resistance
Solution Approach 2:
The resin seal body is given multiple functions: it provides both mechanical sealing and electrostatic protection through the incorporation of conductive particles. This multi-functional design allows the same component to serve dual purposes, reducing the need for additional protective circuits and lowering device complexity
2Reliability
If an external protective circuit (Zener diode) is installed with the semiconductor package, then the resistance to static electricity is improved, but the manufacturing cost increases
Solution Approach 1:
The protective function is merged into the resin seal manufacturing process itself by mixing conductive particles into the resin material. This integration means the protection feature is added during normal manufacturing without requiring separate assembly steps or additional components, thereby avoiding cost increases associated with external protective circuits
Solution Approach 2:
The resin seal body provides its own protective function through the conductive particles embedded within it. This self-service approach eliminates the need for external protective components that would require separate procurement and assembly, thereby reducing manufacturing costs while maintaining static electricity resistance
3Ease of operation
If the conductive body is made removable, then the ease of operation is improved, but the reliability may be compromised
Solution Approach 1:
The conductive body transitions from a fixed state during manufacturing to a removable state during operation. The design allows the conductive body to be easily removed after the semiconductor device is mounted on the circuit board, providing dynamic adaptability that maintains reliability during critical phases while enabling ease of operation during assembly and testing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The conductive body effectively protects the semiconductor device from static electricity by ensuring all electrodes are at the same potential, preventing discharge currents and reducing the risk of damage during handling, while being easily removable to avoid additional manufacturing steps and cost increases.
Implementation Method 1
a first conductive body connected to the leads and contactable with a second conductive body
Implementation Method 2
protecting against static electricity without the need for external components
Data Source
AI summary
According to one embodiment, an electronic component includes a device having a plurality of electrodes; a lead electrically connected to each of the plurality of electrodes; a first resin body sealing the device and a portion of the lead; and a first conductive body connected to the leads and contactable with a second conductive body.