Semiconductor Package Test Socket for Fine-Pitch Conversion
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Solution Overview
Problem
Existing test sockets face challenges in connecting semiconductor packages with different pitches to test boards due to direct contact damage, durability issues, and inability to handle fine pitches from high integration, leading to short circuits and increased costs.
Innovation Solution
A test apparatus with a pitch converter using a multi-layered organic device and conductive contact pins, which converts pitches through a substrate with wiring patterns and elastic insulating materials, preventing direct contact damage and allowing for separable components to reduce costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metallic electric conductor is placed directly on the electrically-conductive part to improve electrical contact performance, then electrical contact performance is improved, but damage to the elastic electrically-conductive part occurs
Solution Approach 1:
A soft buffer layer is introduced between the hard metallic electric conductor and the elastic electrically-conductive part. This intermediary soft layer absorbs the mechanical stress and prevents direct contact damage while maintaining electrical conductivity, thus resolving the contradiction between electrical contact performance and durability
Solution Approach 2:
The test socket structure is transformed into a composite material system consisting of multiple layers: the elastic electrically-conductive part, the soft buffer layer, and the hard metallic electric conductor. This composite structure combines the advantages of each material to achieve both good electrical contact and durability
2Device complexity
If the electrically-conductive part is formed in a pillar shape to simplify the structure, then structural simplicity is achieved, but the socket can only be used when the pitch of the semiconductor package is the same as the pitch of the test board
Solution Approach 1:
The pitch conversion function is achieved by adding a horizontal dimension through the pitch conversion layer with conductive patterns, while the vertical pillar structure of the electrically-conductive part is maintained. This allows the simple vertical structure to be combined with a complex horizontal routing layer to achieve pitch adaptation
3Quantity of substance
If the pitch of the semiconductor package is made finer to increase integration, then integration density is improved, but the existing test socket cannot be used due to pitch mismatch
Solution Approach 1:
The test socket is segmented into functionally independent layers: the elastic electrically-conductive part for vertical contact, the soft buffer layer for protection, the pitch conversion layer for pitch adaptation, and the insulating layer for isolation. This segmentation allows each layer to be optimized for its specific function, enabling fine pitch compatibility while maintaining overall system performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables connection of semiconductor packages with different pitches without modifying the test board, enhances durability by preventing direct contact damage, and supports fine pitches, reducing costs through replaceable components.
Implementation Method 1
The rubber socket has a configuration in which electrically-conductive parts having a plurality of electrically-conductive particles contained within an elastic material such as silicon or the like are disposed to be insulated from each other inside an insulating part made of an elastic material such as silicon or the like. The above rubber socket has the property that it shows the conductivity only in a thickness direction
Implementation Method 2
The above rubber socket has the property that it shows the conductivity only in a thickness direction
Data Source
AI summary
The objective of the present disclosure is to provide a semiconductor package test apparatus for testing a semiconductor package by means of connecting a semiconductor package and a test board. The test apparatus according to the present disclosure comprises: a conductive part mounted on a test board providing a test signal, formed at each of positions corresponding to a pad of the test board, and having a plurality of conductive particles aligned in a thickness direction in an elastic insulating material; a test socket made of an elastic insulating material and including an insulating part insulating the conductive part from another adjacent conductive part while supporting the conductive part; a multi-layer organic product closely disposed on the upper side of the test socket and having a lower land formed at each of positions corresponding to the conductive part, an upper land formed at each of positions corresponding to a terminal of the semiconductor package, and a wiring pattern connecting the lower land and the upper land formed in a substrate; and a pitch converter deposited on the upper land and having conductive contact pins contacting the terminals of the semiconductor package, wherein the lower end of the conductive part is connected to the pad of the test board, and the upper end of the conductive part is connected to the lower land, such that the semiconductor package and the test board having different pitches can be tested.