Semiconductor Package Thermal Diffusion Structure for Heat Dissipation
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Solution Overview
Problem
Semiconductor packages face challenges in managing thermal properties due to increased power consumption and heat generation from high-speed, high-capacity electronic components, necessitating improved thermal management solutions.
Innovation Solution
The semiconductor package design incorporates a thermal diffusion structure with a heat sink and heat slug to efficiently discharge heat generated by the die, utilizing interposer areas and TIMs for effective thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electronic components are designed for high speed and increased capacity, then performance is improved, but power consumption increases leading to poor thermal properties
Solution Approach 1:
The patent introduces a thermal diffusion structure that extends heat dissipation from the traditional planar direction into the vertical dimension. The heat slug penetrates through the interposer substrate thickness direction, creating a three-dimensional heat dissipation pathway that efficiently conducts heat away from the die in the vertical direction while maintaining package performance.
Solution Approach 2:
The patent introduces an interposer substrate as an intermediary component between the die and the heat dissipation structure. The interposer substrate with integrated thermal diffusion structure acts as a mediator that facilitates efficient heat transfer from the die to the external environment, resolving the thermal management issue while maintaining electrical connectivity and mechanical stability.
2Power
If heat is generated in the die, then power consumption is utilized for operation, but heat accumulation occurs affecting adjacent packages and causing substrate warpage
Solution Approach 1:
The patent extracts the heat accumulation problem by introducing a dedicated thermal diffusion structure that actively removes heat from the die. The heat slug and associated thermal pathways extract thermal energy from the die region through the interposer substrate, preventing heat accumulation that would otherwise cause substrate warpage and reliability issues.
Solution Approach 2:
The patent applies local quality by concentrating thermal diffusion capabilities specifically in regions where heat generation occurs. The thermal diffusion structure is strategically positioned and configured to provide enhanced heat dissipation exactly where the die generates heat, rather than uniformly distributing thermal management across the entire package.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances thermal dissipation, minimizing heat impact on adjacent components and preventing substrate warpage, thereby improving the reliability and performance of semiconductor packages.
Implementation Method 1
a first thermal interface material (TIM) on the upper die... The interposer is in contact with a top face of the first TIM... heat generated in the lower die or the upper die is discharged through the thermal diffusion structure
Implementation Method 2
The thermal diffusion structure includes a heat sink on the top face of the interposer in the first area... heat generated in the first die is discharged through the thermal diffusion structure
Implementation Method 3
a second TIM is on the heat sink, and a heat slug is in direct contact with the second TIM so as to cover a side face of the heat sink and a side face of the first package. The heat slug is fixed to the package substrate of the first package
Data Source
AI summary
A semiconductor package with improved thermal properties is provided. The semiconductor package includes a first package including a first die, an interposer on the first package and including a first area and a second area. A second package is on a top face of the interposer in the second area, and a thermal diffusion structure is on a top face of the interposer in the first area. The thermal diffusion structure is configured so that heat generated in the first die is discharged through the thermal diffusion structure.