Semiconductor Package With Through Via Frame
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Solution Overview
Problem
Current semiconductor packages face limitations in miniaturization and fine pitch due to the challenges of maintaining signal integrity and reducing manufacturing costs, particularly in three-dimensional stacking techniques.
Innovation Solution
A semiconductor package design featuring a frame with through vias and conductive balls, where the frame includes a core layer and protective layers, and the through vias have a penetrating part and a connection extending part to enhance signal transmission and connection reliability, along with a method of manufacturing that involves encapsulating semiconductor chips and forming a wiring part to connect the through vias to external terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a package-on-package (PoP) structure is used in related art, then signal transmission between upper and lower portions can be achieved, but the package thickness cannot be sufficiently reduced and fine pitch requirements cannot be satisfied
Solution Approach 1:
The through via extends vertically through the frame in the thickness direction, transitioning from planar connections to three-dimensional vertical connections. This dimensional change enables signal transmission through the package thickness while maintaining fine pitch capability, as the via holes can be precisely positioned and filled with conductive material to create reliable vertical interconnects
Solution Approach 2:
The frame is segmented into multiple functional layers including a core layer and protective layers, with through vias penetrating through these segments. This segmentation allows independent optimization of each layer - the core layer provides structural support and via formation, while protective layers provide mechanical protection and planarization, enabling both thin profile and fine pitch
2Strength
If the frame is provided as a PCB with core layer and protective layers, then structural integrity and protection are improved, but manufacturing complexity increases
Solution Approach 1:
The core layer and protective layers are merged into a single integrated frame structure that is formed as one piece through PCB manufacturing processes. This merging provides structural integrity by combining support and protection functions in a unified component, while the standard PCB manufacturing processes keep production complexity manageable through established fabrication techniques
Solution Approach 2:
The frame serves multiple functions simultaneously: it provides structural support through the core layer, mechanical protection through protective layers, electrical interconnection through through vias, and signal transmission pathways. This multi-functionality reduces the need for separate components, simplifying the overall device architecture despite the frame's complex structure
3Reliability
If through vias with connection extending parts are used, then connection reliability is improved, but manufacturing process complexity increases
Solution Approach 1:
The connection extending part is formed as an integral extension of the via hole during the PCB fabrication process, before final assembly. This preliminary formation of the extended connection structure ensures proper alignment and connection geometry is built-in from the start, improving reliability while avoiding complex post-assembly operations
Solution Approach 2:
The via structure serves itself by having the connection extending part automatically formed as part of the via fabrication process. The via hole etching and conductive material deposition processes naturally create the extended connection regions that interface with both the core layer and protective layers, eliminating the need for separate manufacturing steps
Data Source
AI summary
Disclosed are a semiconductor package including a through via and a method of manufacturing the same. The semiconductor package includes a frame having an accommodation part and configured to transmit an electrical signal between upper and lower portions thereof through a through via provided around the accommodation part, one or more semiconductor chips accommodated in the accommodation part, a wiring part provided below the frame and the semiconductor chips and configured to connect the through via to the semiconductor chips, an encapsulant molded to integrate the frame and the semiconductor chips, and a conductive ball or a conductive post connected to an upper portion of the through via.