Semiconductor Package Uniform Bump Array Single Mask Process
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Solution Overview
Problem
The existing methods for manufacturing semiconductor packages are complex and costly due to the need for different mask patterns and processes for various bonding pad designs, leading to a lengthy development time and increased costs.
Innovation Solution
A semiconductor package design featuring a substrate with uniformly disposed bumps, including both electrically connected and dummy bumps, which simplifies the bumping process by using a single mask pattern and metal layer structure across the entire substrate, allowing for efficient electrical connections and support without the need for multiple process variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If different mask patterns are used for various bonding pad designs, then electrical connection reliability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent applies universality by using a single uniform mask pattern for all substrate regions regardless of bonding pad locations. The mask pattern serves multiple functions: it defines bump positions over bonding pads for electrical connection, and also defines dummy bump positions in non-bonding pad areas for mechanical support. This eliminates the need for different mask patterns for different device types, simplifying the manufacturing process while maintaining connection reliability.
Solution Approach 2:
The patent segments the bump structure into two functional types: real bumps positioned over bonding pads for electrical connection, and dummy bumps positioned in non-bonding pad areas for mechanical support and stress distribution. This segmentation allows a single mask pattern to serve multiple purposes, resolving the contradiction between reliability and complexity.
2Manufacturing precision
If multiple mask patterns are manufactured for different device types, then electrical connection precision is improved, but manufacturing cost and development time increase
Solution Approach 1:
A single universal mask pattern is designed to work for all device types and bonding pad configurations. The mask pattern defines a regular array of openings that can accommodate both real bumps (over bonding pads) and dummy bumps (in non-bonding pad areas). This eliminates the need to manufacture different mask patterns for different devices, reducing manufacturing cost and development time while maintaining precise bump positioning through the uniform opening arrangement.
3Strength
If dummy bumps are added to non-bonding pad areas, then mechanical durability is improved, but device complexity increases
Solution Approach 1:
The bump structure is segmented into real bumps and dummy bumps based on their functional requirements. Dummy bumps are strategically placed in non-bonding pad areas to provide mechanical support, distribute stress, and prevent substrate deformation. While this adds structural elements, the use of a uniform mask pattern keeps the manufacturing process simple, effectively managing the complexity while improving mechanical durability.
Data Source
AI summary
A semiconductor package and a method of manufacturing the semiconductor package. The semiconductor package include a substrate including a plurality of pads and a plurality of bumps evenly disposed on an entire region of the substrate regardless of an arrangement of the plurality of pads. According to the present invention, a simplification of a process can be accomplished, a cost of a process can be reduced, reliability can be improved and an under-filling can become easy.