Semiconductor Package Venting Structure for Adhesion and Gas Discharge
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Solution Overview
Problem
Conventional semiconductor packages face issues with warping, heat dissipation, and reliability due to increased area, which are exacerbated by the use of adhesive members in closed loop shapes that hinder gas discharge and adhesion between the cover member and substrate.
Innovation Solution
A semiconductor package design featuring a protective layer with open loop adhesive members and strategically placed openings to facilitate gas discharge, enhance adhesion, and improve heat dissipation, while maintaining structural integrity and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the adhesive member is applied in a closed loop shape to the circumferential region of the package substrate, then the adhesion between the cover member and substrate is improved, but gas cannot be discharged during thermal process and physical reliability deteriorates
Solution Approach 1:
The adhesive member is segmented into multiple separate adhesive regions rather than forming a continuous closed loop. This segmentation creates gaps between adhesive regions that serve as vent holes for gas discharge, while still maintaining sufficient adhesive coverage for reliable bonding between the cover member and substrate.
2Reliability
If the width of regions where adhesive member is not applied is increased to function as vent holes, then gas discharge is improved, but adhesive force between package substrate and cover member deteriorates
Solution Approach 1:
The adhesive member is strategically positioned in specific circumferential regions where it provides both adhesion and gas discharge functionality. The adhesive is applied in discrete patterns that concentrate bonding strength at critical locations while leaving gaps in non-critical areas for venting, optimizing the balance between adhesion and gas discharge.
3Adaptability or versatility
If the area of semiconductor package is increased to accommodate high specifications and HBM, then performance is improved, but warping and heat generation problems worsen
Solution Approach 1:
The adhesive member is divided into multiple discrete regions distributed around the circumferential area of the package substrate. This segmented configuration provides distributed bonding points that help counteract warping forces across the large package area, improving dimensional stability while accommodating high-performance components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively addresses warping and heat dissipation issues, enhances adhesion, and ensures reliable gas discharge, leading to improved product reliability and miniaturization of semiconductor packages.
Implementation Method 1
The cover member is attached to an adhesive member applied on the package substrate
Implementation Method 2
The cover member includes a metal material with excellent heat conductivity
Data Source
AI summary
A semiconductor package according to an embodiment includes a substrate; a protective layer disposed on the substrate; a first adhesive member disposed on the protective layer and having an open loop shape along a circumferential direction of an upper surface of the protective layer; and a cover member disposed on the first adhesive member, wherein a lower surface of the cover member includes: a first lower surface that contacts the first adhesive member, and a second lower surface that does not contact the first adhesive member, and the protective layer includes a first opening that vertically overlaps the second lower surface of the cover member and does not vertically overlap the first adhesive member.