Semiconductor Package Vertical Interconnect for Waveguide Antenna Signal Loss
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Solution Overview
Problem
High-frequency RF semiconductor devices, particularly mmWave systems, face challenges in minimizing signal losses and power consumption due to the distance and number of connections between transmit/receive circuitry and waveguide antennas, leading to reduced sensitivity and power efficiency.
Innovation Solution
The solution involves positioning waveguide antenna feeds directly above the IC die within the semiconductor package, using vertical interconnects and electromagnetic shielding to reduce signal path length and minimize power loss, with processes like wire bonding and additive manufacturing to form optimal signal paths and shielding structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If waveguide antennas are mounted on PCBs with antenna feeds on the periphery of the integrated circuit package, then the device can be manufactured with standard packaging processes, but the distance between the transmit/receive circuitry and antennas increases causing signal degradation and power loss
Solution Approach 1:
The patent transitions from a planar peripheral arrangement to a three-dimensional vertical arrangement by forming antenna feeds directly on the top surface of the IC die and using vertical interconnects through the package substrate. This dimensional change reduces the signal path length from the circuitry to the antenna feeds while maintaining manufacturability through standard packaging processes modified for vertical integration.
2Loss of energy
If the distance between transmit/receive circuitry and waveguide antennas is reduced to minimize power loss, then signal efficiency improves, but the package structure becomes more complex requiring vertical interconnects and modified packaging
Solution Approach 1:
The patent merges the antenna feed formation process with the IC packaging process itself. Antenna feeds are formed directly on the top surface of the IC die using the same semiconductor fabrication processes, and vertical interconnects are integrated into the package substrate during packaging. This consolidation reduces the need for separate antenna mounting steps and simplifies the overall structure despite the three-dimensional arrangement.
3Reliability
If antenna feeds are positioned directly above the IC die to minimize signal path length, then sensitivity and power efficiency are enhanced, but the manufacturing process requires additional steps for vertical interconnect formation and electromagnetic shielding
Solution Approach 1:
The patent performs preliminary actions by forming antenna feeds directly on the IC die surface before final package assembly, and by pre-forming vertical interconnect structures in the package substrate. Electromagnetic shielding structures are also integrated during the packaging process rather than added separately. These preliminary actions streamline the overall manufacturing process despite the additional complexity of vertical integration.
Data Source
AI summary
A mechanism is provided to reduce a distance of a waveguide antenna from transmit and receive circuitry in an integrated circuit device die. This distance reduction is performed by providing vertical access to radio frequency connections on a top surface of the IC device die. A cavity in the encapsulant of the package can be formed to provide access to the connections and plated to perform a shielding function. A continuous connection from the RF pads is used as a vertical interconnect. The region around the vertical interconnect can be filled with encapsulant potting material and back grinded to form a surface of the semiconductor device package. A waveguide antenna feed can be plated or printed on the vertical interconnect on the surface of the package.