Semiconductor Package Wiring Layout for Visible Solder Joints
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Solution Overview
Problem
In miniaturized semiconductor devices, it is difficult to visually recognize the solder connections from the outside, making it challenging to assess the mounting state on a wiring board.
Innovation Solution
A semiconductor device design featuring an electrically insulating substrate with a semiconductor element, a heat-dissipating conductive portion, a sealing resin, and exposed wiring portions that extend from the conductive portion to the substrate side surfaces, allowing for improved visibility and connection to the wiring board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the semiconductor device is miniaturized to progress device scaling, then device size is reduced and integration density is improved, but the solder connections become difficult to visually recognize from the outside
Solution Approach 1:
The patent introduces a wiring portion that extends in a direction intersecting the thickness direction (from back surface toward side surface), creating a three-dimensional configuration. This allows the wiring to be visible from the side surface while maintaining the compact footprint of the device, effectively using spatial dimensionality to resolve the visibility issue without increasing device size.
Solution Approach 2:
The wiring portion acts as an intermediary element that connects the heat-dissipating conductive portion (at the back surface) to the side surface of the substrate. This intermediary structure provides both thermal conduction and visual indication of the mounting state, allowing external observation of solder connections without compromising device miniaturization.
2Reliability
If terminals are exposed from the back surface for mounting, then electrical connection is enabled, but the solder bonding state cannot be visually confirmed from the outside
Solution Approach 1:
The patent merges the heat-dissipating conductive portion with the wiring structure, creating a unified component that serves both thermal management and visual indication functions. The wiring portion is electrically connected to the heat-dissipating conductive portion and extends to the side surface, allowing simultaneous achievement of reliable electrical connection and visual confirmation of solder bonding state.
Solution Approach 2:
The wiring portion performs multiple functions: it provides electrical connection between the heat-dissipating conductive portion and external circuits, serves as a heat conduction path, and acts as a visual indicator of the mounting state. This multi-functionality resolves the contradiction by enabling visual confirmation without adding separate components that would increase device size.
3Temperature
If a heat-dissipating conductive portion is provided overlapping the semiconductor element, then heat dissipation efficiency is improved, but the structure becomes more complex
Solution Approach 1:
The patent combines the heat-dissipating conductive portion with the wiring structure into a single integrated component. The wiring portion is electrically and thermally connected to the heat-dissipating conductive portion and extends to the side surface, eliminating the need for separate heat dissipation structures and reducing overall device complexity while maintaining effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the visibility of solder connections and improves the mounting state assessment by ensuring clear exposure of wiring and conductive elements, facilitating better integration with wiring boards.
Implementation Method 1
a heat-dissipating conductive portion that is provided at a position overlapping with at least a portion of the semiconductor element when viewed from the thickness direction and is exposed from the substrate back surface
Data Source
AI summary
A semiconductor device includes an electrically insulating substrate including a substrate main surface and a substrate back surface facing opposite to each other in a thickness direction and at least one substrate side surface facing a direction intersecting the thickness direction, a semiconductor element arranged at a side of the substrate main surface, a heat-dissipating conductive portion that is provided at a position overlapping with at least a portion of the semiconductor element when viewed from the thickness direction and is exposed from the substrate back surface, a sealing resin that seals the semiconductor element while covering the substrate main surface, and at least one wiring portion that is connected to the heat-dissipating conductive portion, extends from the heat-dissipating conductive portion to the substrate side surface while being exposed from the substrate back surface, and is exposed from the substrate side surface.