Semiconductor Package Clamping for Warpage Flattening Stability
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Solution Overview
Problem
Thinned semiconductor package structures with warpage due to CTE mismatch between semiconductor dies and molding compounds are difficult to flatten and stabilize, making subsequent processing steps challenging due to increased distance and potential shifting and vibration.
Innovation Solution
A clamp apparatus comprising a chuck, a pressing tool, and a moving device that allows for transverse movement of the pressing tool above the package body, enabling effective pressing and flattening of the package body on the chuck using a combination of suction and adjustable geometry to maintain stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the molded wafer is thinned to reduce package thickness, then the package thickness is reduced, but severe warpage occurs due to CTE mismatch between semiconductor die and molding compound
Solution Approach 1:
The pressing tool applies pressure to the package body before subsequent processing steps to pre-flatten the warpage. This preliminary action prevents shifting and vibration during later processing by establishing a stable, flat configuration in advance.
Solution Approach 2:
The pressing tool is made movable by a moving device, allowing dynamic adjustment of the pressing position and application of force. This enables the system to adapt to varying warpage patterns and apply corrective pressure where needed, transforming a static flattening approach into a dynamic, adaptive solution.
2Shape
If the warped molded wafer is placed on a chuck for flattening, then flattening is attempted, but negative pressure or vacuum cannot be created due to large distance between chuck and warped wafer
Solution Approach 1:
The pressing tool first applies pressure to reduce the distance between the chuck and the warped wafer by partially flattening it. This preliminary compression creates sufficient contact for the chuck to then establish effective negative pressure or vacuum for complete flattening.
Solution Approach 2:
The pressing tool acts as an intermediary between the chuck and the warped wafer. It mediates the flattening process by first compressing the wafer to reduce the gap, enabling the chuck's vacuum field to then effectively engage with the wafer surface.
3Shape
If the warped molded wafer is placed on a chuck, then flattening is attempted, but the warped wafer shifts and vibrates during the process
Solution Approach 1:
The pressing tool applies pressure to stabilize the package body before subsequent processing steps. This preliminary stabilization prevents shifting and vibration during later operations by securing the package in a fixed, flat position on the chuck.
Solution Approach 2:
The pressing tool serves as a stabilizing intermediary that applies continuous pressure to prevent the warped wafer from shifting or vibrating. It mediates between the unstable warped wafer and the chuck, maintaining position stability throughout the flattening process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures that semiconductor package structures can be accurately pressed and flattened without shifting or vibration, facilitating subsequent processing steps and improving the manufacturing efficiency of semiconductor packages.
Implementation Method 1
it is difficult to create a negative pressure or a vacuum between the chuck and the warped molded wafer
Data Source
AI summary
A method for manufacturing a semiconductor package structure and a clamp apparatus are provided. The method includes: (a) providing a package body disposed on a chuck, wherein the package body includes at least one semiconductor element encapsulated in an encapsulant; (b) moving a pressing tool transversely to above the package body; and (c) pressing the package body on the chuck through the pressing tool.