Semiconductor Package Affixing Blocks for Thermal Warpage Relief

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Solution Overview

Problem

Existing semiconductor packaging technologies face challenges in integrating multiple semiconductor dies and modules while maintaining structural integrity and reliability, particularly due to thermal stress and warpage issues during manufacturing processes.

Innovation Solution

The implementation of insulating affixing blocks made of polymer materials, which are formed on a redistribution circuit structure and positioned between semiconductor modules and the package, providing stress relief and enhancing the structural stability by counterbalancing thermal expansion and contraction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If multiple semiconductor dies and modules are integrated into a compact package, then the integration density and functionality are improved, but thermal stress and warpage issues worsen during manufacturing processes

Engineering Contradiction:

Improveintegration densityVSAvoidstructural integrity

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent introduces insulating affixing blocks as intermediary elements positioned between the semiconductor modules and the package substrate. These blocks serve as stress-absorbing intermediaries that decouple the thermal expansion differences between dissimilar materials, thereby preventing direct stress transmission that would cause warpage and delamination while maintaining high integration density

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent employs composite structures combining different materials with complementary properties: the insulating affixing blocks are made of polymer materials that provide both mechanical compliance for stress relief and electrical insulation. This composite approach allows the package to accommodate thermal stress while maintaining structural integrity and enabling higher integration density

Inventive Principle:

Principle #40Composite materials

2Stability of the object's composition

If semiconductor modules are tightly attached to the package substrate, then the structural stability is improved, but thermal expansion and contraction cause warpage and delamination

Engineering Contradiction:

Improvestructural stabilityVSAvoidthermal stress

Core Design Contradiction:

Stability of the object's compositionVSObject-affected harmful factors

Solution Approach 1:

The patent applies beforehand cushioning by placing compliant insulating affixing blocks between the rigid semiconductor modules and substrate before thermal cycling occurs. These blocks pre-positioned in the assembly absorb and distribute thermal stresses during expansion and contraction, preventing warpage and delamination while maintaining structural stability

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The patent changes the mechanical parameters of the attachment system by introducing materials with appropriate elastic moduli and thermal expansion coefficients. The insulating affixing blocks have tailored mechanical properties that allow them to deform under thermal stress, changing the stress distribution parameters to prevent warpage while maintaining stable attachment

Inventive Principle:

Principle #35Parameter changes

3Strength

If rigid bonding structures are used to secure modules, then the attachment strength is improved, but cracking and delamination occur during thermal processes

Engineering Contradiction:

Improveattachment strengthVSAvoidcracking and delamination

Core Design Contradiction:

StrengthVSObject-generated harmful factors

Solution Approach 1:

The patent replaces rigid bonding structures with flexible insulating affixing blocks made of polymer materials. These flexible elements maintain attachment strength while accommodating thermal expansion and contraction through elastic deformation, preventing cracking and delamination that would occur with rigid bonding alone

Inventive Principle:

Principle #30Flexible shells and thin films

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly improves the reliability and yield of the semiconductor package by minimizing warpage and reducing delamination and cracking, ensuring stable attachment of modules during thermal processes.

Implementation Method 1

providing stress relief and enhancing the structural stability by counterbalancing thermal expansion and contraction

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS20260090476A1Semiconductor package and manufacturing method of the same

Publication Date: 2026.03.26 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A semiconductor package and a manufacturing method thereof are described. The semiconductor package includes a package having dies encapsulated by an encapsulant, a redistribution circuit structure, first and second modules and affixing blocks. The redistribution circuit structure is disposed on the package. The first and second modules are disposed on and respectively electrically connected to the redistribution circuit structure by first and second connectors disposed there-between. The first and second modules are adjacent to each other and disposed side by side on the redistribution circuit structure. The affixing blocks are disposed on the redistribution circuit structure and between the first and second modules and the redistribution circuit structure. The affixing blocks include first footing portions located below the first module, second footing portions located below the second module, and exposed portions exposed from the first and second modules. The affixing blocks join the first and second modules to the redistribution circuit structure.