Thermally Conductive Pillars in Semiconductor Packages
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Solution Overview
Problem
Semiconductor device encapsulants have low thermal conductivity, leading to inefficient heat dissipation from heat-generating components, which can result in premature device failure due to inadequate heat dissipation.
Innovation Solution
Incorporating one or more thermally conductive layers, such as copper or aluminum, between the heat-generating components and the encapsulant, with pillars extending through the encapsulant to facilitate heat transfer to an outer thermally conductive layer on the package surface, enhancing heat dissipation to the environment or substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If encapsulant materials are used to protect heat-generating components, then component protection is improved, but heat dissipation deteriorates due to low thermal conductivity
Solution Approach 1:
The patent uses a composite structure combining encapsulant material with a thermally conductive layer. The encapsulant provides protection while the thermally conductive layer (made from materials like aluminum, copper, or graphite with thermal conductivity ≥10 W/m·K) provides heat dissipation pathways, resolving the contradiction between protection and heat management
Solution Approach 2:
The heat dissipation function is segmented from the encapsulant by introducing a separate thermally conductive layer. This layer can be positioned between the component and encapsulant, on the encapsulant surface, or within the encapsulant structure, allowing independent optimization of protection and thermal management functions
2Temperature
If thermally conductive layers are added to improve heat dissipation, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The thermally conductive layer serves multiple functions: it provides primary heat dissipation pathways, acts as a thermal interface material, and can serve as a structural support element. This multi-functionality reduces the need for additional separate components, mitigating the increase in device complexity
Solution Approach 2:
The thermally conductive layer can be implemented as a thin film or coating on the encapsulant surface or component背面, minimizing the added thickness and structural complexity while maintaining effective thermal conduction. The layer can conform to complex geometries without requiring rigid additional structures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly improves heat dissipation from semiconductor devices by using thermally conductive materials with higher conductivity than the encapsulant, reducing the risk of premature failure through effective heat management.
Implementation Method 1
one or more thermally conductive layers in thermal communication with a heat-generating component... heat is dissipated from the heat-generating component toward a surface of the semiconductor device package and/or the surrounding environment via the one or more thermally conductive layers
Data Source
AI summary
A semiconductor device package includes a substrate, a heat-generating component positioned on a surface of the substrate, and an encapsulant at least partially covering the heat-generating component and having an outer surface. A first heat-conducting layer is disposed between the encapsulant and the first heat-generating component. One or more pillars are in contact with the first heat-conducting layer and extend to the outer surface of the encapsulant and contact a second heat-conducting layer disposed on the outer surface of the encapsulant.