Semiconductor Packaging Compensation Part for Thermal Stress
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Solution Overview
Problem
The existing semiconductor packaging methods cause deformation and cracking in semiconductor elements due to thermal expansion differences between the packaging component and the semiconductor element, leading to undesirable phenomena such as cracking, deformation, and fatigue, which affect the electrical and optical properties of photosensitive semiconductor elements.
Innovation Solution
A semiconductor packaging method that incorporates a compensation part between the packaging component and the semiconductor element, allowing the compensation part to deform and absorb the difference in thermal expansion, preventing pull forces and maintaining the integrity of the semiconductor element's surface during the baking process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a baking process is carried out to achieve reliable encapsulation between the packaging component and the semiconductor element, then the bonding strength is improved, but the semiconductor element undergoes deformation and cracking due to thermal expansion differences
Solution Approach 1:
A compensation part is introduced as an intermediary component between the packaging component and the semiconductor element. This compensation part absorbs the thermal expansion stress generated during the baking process, preventing the stress from being transmitted to the semiconductor element. The compensation part acts as a buffer that decouples the thermal expansion of the packaging component from the semiconductor element, thereby maintaining surface integrity while still achieving reliable encapsulation bonding.
2Adaptability or versatility
If the packaging component is made with different material than the semiconductor element to achieve functional requirements, then the functional performance is improved, but thermal expansion differences cause deformation and cracking
Solution Approach 1:
The packaging structure is segmented into three distinct parts: the packaging component, the compensation part, and the semiconductor element. This segmentation allows each component to be made from materials optimized for its specific function. The packaging component can use materials with appropriate functional properties, the compensation part uses materials designed to absorb thermal stress, and the semiconductor element maintains its original material properties. This segmentation resolves the conflict between functional performance and structural reliability by distributing different material requirements to different segments.
3Manufacturing precision
If the compensation part is added between the packaging component and the semiconductor element to prevent deformation, then the surface integrity is improved, but the device structure becomes more complex
Solution Approach 1:
The compensation part is implemented as a thin, flexible layer or film positioned between the packaging component and the semiconductor element. This thin-film approach provides the necessary stress absorption and compensation functionality while minimizing the increase in structural complexity. The flexible nature of this thin film allows it to conform to the interfaces it bridges, and its thin profile means it adds minimal complexity to the overall packaging structure while effectively preventing deformation and maintaining surface integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures reliable encapsulation, reduces deformation, and maintains the optical and electrical properties of the semiconductor element, particularly for photosensitive elements, by compensating for thermal expansion differences and preventing cracking.
Implementation Method 1
the compensation part undergoes different degrees of deformation at different positions to compensate for a difference between an extent of deformation of the packaging component and an extent of deformation of the semiconductor element during hardening of the packaging component
Data Source
AI summary
The present invention provides a semiconductor packaging method and semiconductor device based on a molding process. In the packaging method, first, at least a portion of a compensation part is kept on at least a portion of a bonding region formed between a first adjoining surface of a semiconductor element and a second adjoining surface of a packaging component, to form a semi-finished product of a semiconductor device; then, during hardening of the packaging component, the compensation part is caused to undergo different degrees of deformation at different positions to compensate for a difference between a magnitude of deformation of the packaging component and a magnitude of deformation of the semiconductor element, so as to package the semiconductor element to form the semiconductor device. By means of the method, undesirable phenomena such as cracking and deformation of the surface of the semiconductor element can be avoided.