Semiconductor Input Output Pad Data Alignment Circuit
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor memory devices face challenges in optimizing the arrangement of input/output pads and circuits to achieve high data transfer rates and bandwidth within a limited area, particularly in mobile environments, where data synchronization with clock and strobe signals requires efficient domain crossing operations.
Innovation Solution
The memory device incorporates a data alignment circuit within the pad area, overlapping with data and voltage pads, which includes data conversion, selection, and driving circuits to align and transmit data in parallel, reducing the need for delay lines and optimizing pad layout to share input/output lines, thereby minimizing area and power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If data alignment circuit is added to align input/output data, then data transfer rate and bandwidth are improved, but device area increases
Solution Approach 1:
The data alignment circuit merges the data conversion circuit and data driving circuit into a single integrated structure within the pad area. The data conversion circuit converts serial data to parallel data, and the data driving circuit drives the parallel data through global input/output lines, combining multiple functions in one location to avoid area expansion
Solution Approach 2:
The data alignment circuit utilizes the vertical dimension by positioning itself in the pad area overlapping with data pads and voltage pads. This layered arrangement allows the circuit to occupy space in the vertical dimension rather than expanding the horizontal footprint, effectively utilizing three-dimensional space
2Manufacturing precision
If delay lines are used for data synchronization, then timing accuracy is improved, but device area and power consumption increase
Solution Approach 1:
The invention extracts and eliminates the delay line component from the traditional data synchronization approach. Instead of using physical delay lines to adjust timing, the data alignment circuit achieves timing accuracy through direct data conversion and driving circuits that synchronize data with clock signals inherently
Solution Approach 2:
The invention replaces the mechanical/physical delay line system with an electronic data conversion system. The data conversion circuit and data driving circuit electronically synchronize data timing with clock signals, substituting the need for physical delay elements with active electronic control
3Area of stationary object
If pad area is optimized to share input/output lines, then device area is reduced, but circuit complexity increases
Solution Approach 1:
The data alignment circuit is designed with multi-functionality, serving both data conversion and data driving functions within the same pad area. The circuit handles multiple tasks (serial-to-parallel conversion, data driving, timing synchronization) through integrated circuits, reducing the need for separate dedicated components and simplifying the overall architecture
Data Source
AI summary
A memory device includes a data pad disposed in a first pad area and configured to receive data, a data strobe pad disposed in the first pad area and configured to receive a data strobe signal, a clock pad disposed in a second pad area adjacent to the first pad area and configured to receive a clock signal, a data conversion circuit disposed in the first pad area and configured to convert the data inputted through the data pad into parallel data based on the data strobe signal, and a data driving circuit disposed in the first pad area and configured to transmit the parallel data through a global input and output line based on the clock signal.