Semiconductor Pad Arrangement for Multi-Bit DQ Signal Routing
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Solution Overview
Problem
Semiconductor devices with 4-bit or 8-bit structures face issues with long connecting wires and high wiring density due to the absence of DQ system high-order bit side pins, leading to increased inductance, power supply noise, and reduced design freedom, as well as manufacturing reliability challenges.
Innovation Solution
The semiconductor device includes a semiconductor chip that can function as an 8-bit or 16-bit device, with specifically arranged DQ pad groups and additional pads in the second area to match both 16-bit and 8-bit pin arrangements, optimizing pad and pin connections to reduce wiring length and density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If DQ system pins are connected to DQ system low-order bit side pads using long connecting wires to accommodate ×4 or ×8 device configurations, then the device can serve as lower-bit structure devices, but the wiring length increases and wiring density becomes high
Solution Approach 1:
The patent introduces a second area on the semiconductor chip surface, arranged in the opposite direction from the first area, to provide additional pad locations. This dimensional expansion allows DQ system pins to be connected to pads in the second area, creating shorter connecting wire paths and reducing wiring density while maintaining adaptability for ×4 and ×8 device configurations.
2Adaptability or versatility
If DQ system pins are connected to DQ system low-order bit side pads with long connecting wires, then the device can function as ×4 or ×8 device, but the inductance increases and signal quality deteriorates
Solution Approach 1:
By utilizing the second area located in the opposite direction on the chip surface, the patent provides alternative pad positions that are physically closer to the DQ system pins. This reduces the inductance of connecting wires and improves signal quality while maintaining the ability to configure the device as ×4 or ×8 structure.
3Adaptability or versatility
If DQ system pins are connected to DQ system low-order bit side pads, then the device can serve as ×4 or ×8 device, but the wiring density increases and wiring space becomes limited
Solution Approach 1:
The patent divides the pad arrangement into two distinct areas: a first area for the 16-bit structure device and a second area for the 8-bit structure device. This segmentation allows DQ system pins to be connected to appropriate pads in the second area for ×4 and ×8 configurations, distributing wiring across different regions and reducing wiring density and space constraints.
4Adaptability or versatility
If additional pads are formed in the second area to support both 16-bit and 8-bit configurations, then the device can serve as either structure type, but the pad arrangement complexity increases
Solution Approach 1:
The patent creates a universal pad arrangement where the second area contains additional pads that can serve both 16-bit and 8-bit device configurations. The same physical pads can be assigned to different logical functions depending on the device configuration, reducing overall complexity by eliminating the need for separate pad sets for different bit structures.
Data Source
AI summary
A semiconductor device has a semiconductor chip which is usable as any one of 4-bit, 8-bit, and 16-bit structure devices, and a package for packaging the semiconductor chip. The semiconductor chip has first and second DQ pad groups of DQ system pads for said 16-bit structure device. The first DQ pad group is arranged in a first area at a vicinity of a middle part of a surface of the semiconductor chip while the second DQ pad group is arranged in a second area at an outer side of the first area on the surface. An additional pad necessary as one of DQ system pads for the 8-bit structure device except for pads included in the second DQ pad group is formed in the second area.