Semiconductor Pad Layout With Regional Pitch Variation for Stress Balance
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Solution Overview
Problem
The structural stress imbalance in semiconductor device pads due to material mismatch leads to cracking and peeling, affecting electrical reliability.
Innovation Solution
A semiconductor device design with varying pad sizes and pitches in different regions, including a first region with smaller pitch and pad size compared to a second region, to balance stress and reduce cracking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If uniform pad size and pitch are used across the semiconductor device, then manufacturing is simpler, but stress imbalance causes pad cracking and peeling
Solution Approach 1:
The patent applies local quality by varying pad sizes and pitches in different regions of the semiconductor device. Specifically, pads in the first region have different dimensions and spacing compared to pads in the second region, allowing each region to be optimized for its local stress conditions while maintaining overall device reliability
Solution Approach 2:
The patent changes geometric parameters (pad size and pitch) based on regional stress requirements. By adjusting these parameters across different regions, the design balances structural stress distribution and prevents pad cracking and peeling that would occur with uniform parameters
2Reliability
If variable pad size and pitch are used in different regions, then stress distribution is improved, but design and manufacturing complexity increases
Solution Approach 1:
The patent segments the semiconductor device into multiple regions (first region and second region), each with optimized pad characteristics. This segmentation allows independent optimization of pad size and pitch in each region to address local stress conditions, improving overall stress balance while managing complexity through systematic regional division
Data Source
AI summary
A semiconductor device includes a first region and a second region, and the second region surrounds the first region. The semiconductor device includes at least one electronic unit, a redistribution structure, a plurality of first pads, and a plurality of second pads. The redistribution structure may be electrically connected to at least one electronic unit. A plurality of first pads are arranged on the redistribution structure and correspondingly to the first region. There is a first pitch between two adjacent first pads. A plurality of second pads are arranged on the redistribution structure and correspondingly to the second region. There is a second pitch between two adjacent second pads, so that the first pitch is smaller than the second pitch.