Asymmetric Semiconductor Pad Layout for Wiring Efficiency
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Solution Overview
Problem
Semiconductor devices face challenges in reducing size due to the need for efficient pad and extended part layout, which affects wiring efficiency and susceptibility to physical deformation and foreign substance ingress during manufacturing.
Innovation Solution
A semiconductor device layout featuring a pad group with first and second pads connected via connection parts extending in opposite directions, optimizing the use of the principal surface area and reducing wasted space, allowing for efficient wiring and protection from physical forces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If pads are arranged in a conventional linear fashion with extended parts, then wiring connections can be established, but device size increases and wiring efficiency decreases
Solution Approach 1:
The patent applies asymmetry by positioning second pads at locations shifted from the pad row direction rather than aligning them linearly with first pads. This asymmetric arrangement allows connection parts to extend in opposite directions from respective pads, optimizing the use of available substrate area and reducing overall device footprint while maintaining effective wiring connections to the circuit block
Solution Approach 2:
The patent transitions from a one-dimensional linear pad arrangement to a two-dimensional布局 by shifting second pads perpendicular to the pad row direction. This dimensional change enables more compact packing of pads and connection parts, improving wiring efficiency while reducing the area occupied by the pad group and extended parts
2Ease of manufacture
If through holes are provided immediately below pads, then wiring connections are simplified, but physical force during manufacturing deforms through holes and foreign substances enter
Solution Approach 1:
The patent extracts the through hole from the immediate pad region by positioning it in the extended part that extends from the pad. This separation removes the through hole from the area subjected to physical force during wire bonding and probing, preventing deformation and foreign substance ingress while maintaining the through hole's essential wiring connection function
Solution Approach 2:
The extended part serves as an intermediary structure between the pad and the through hole. It provides a protected pathway that allows the through hole to be positioned away from the pad's vulnerable region while still maintaining electrical connection, thus mediating between the need for simple wiring and the need to protect against manufacturing damage
3Reliability
If pad region is expanded to include extended parts, then protection from physical force is improved, but device size increases
Solution Approach 1:
The asymmetric positioning of second pads and their connection parts allows the extended parts to be distributed more efficiently across the substrate area. This prevents concentration of protected regions in one location, enabling compact overall layout while ensuring each pad's extended part provides adequate protection from physical deformation during manufacturing
4Productivity
If connection parts extend in opposite directions from pads, then wiring efficiency is enhanced, but pad layout complexity increases
Solution Approach 1:
The asymmetric layout with connection parts extending in opposite directions from first and second pads creates an optimized wiring pattern that reduces wire length and improves connection efficiency to the circuit block. While the positioning appears complex, the systematic asymmetric arrangement follows a clear design rule that simplifies manufacturing and testing
Data Source
AI summary
A semiconductor device includes a pad group including pads provided on a semiconductor substrate and arranged in a row to form a pad row as a whole. The pad group includes at least one first pad provided with a first via-connection part electrically connected therewith and extending in a first direction perpendicular to a row direction of the pad row, and at least one second pad provided with a second via-connection part electrically connected therewith and extending in a second direction opposite to the first direction. The at least one second pad is formed at a position moved in the first direction from the row direction of the pad row passing through a center of the at least one first pad.