Semiconductor Conductive Pillars With Zigzag Support Pattern
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Solution Overview
Problem
Current semiconductor devices face challenges in forming reliable and stable cell capacitors with reduced size, particularly in dynamic random access memory (DRAM) devices, where conductive pillars are prone to collapse and deformation due to non-uniform dielectric layer deposition.
Innovation Solution
A semiconductor device design featuring conductive pillars arranged at specific pitches in multiple directions with a support pattern that includes zigzag openings, providing structural stability by dispersing stress and preventing pillar contact during dielectric layer deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conductive pillars are formed with reduced size to meet demand for smaller electronic devices, then device size is reduced, but structural stability deteriorates causing pillar collapse and deformation
Solution Approach 1:
The support pattern is divided into multiple discrete support regions arranged in a matrix configuration, with each support region providing localized support to individual conductive pillars. This segmentation allows the structure to maintain stability while accommodating reduced pillar dimensions, as each pillar receives targeted support without requiring the entire structure to be oversized.
Solution Approach 2:
A dielectric layer is introduced as an intermediary substance between the conductive pillars and the support pattern. This dielectric layer fills the spaces between pillars and provides a uniform bonding interface that prevents direct contact between adjacent pillars, thereby preventing collapse and deformation while allowing the pillars to maintain their reduced size.
2Productivity
If conductive pillars are densely arranged to increase storage capacity, then device functionality is improved, but manufacturing precision deteriorates due to non-uniform dielectric layer deposition
Solution Approach 1:
The support pattern is designed with varying local characteristics - support regions with different geometries and distributions are created to match the local density requirements of different areas. This allows for optimized dielectric layer deposition in high-density regions while maintaining manufacturing feasibility, as the local support structure compensates for the challenges of dense pillar arrangement.
3Stability of the object's composition
If support structure is added to prevent pillar collapse, then structural stability is improved, but device complexity increases
Solution Approach 1:
The support pattern serves multiple functions simultaneously: it provides mechanical support to prevent pillar collapse, acts as a barrier to prevent diffusion between adjacent pillars, and serves as a template for uniform dielectric layer deposition. This multi-functionality reduces the need for additional separate structures, thereby limiting the increase in device complexity while achieving the desired structural stability.
Data Source
AI summary
A semiconductor device includes a plurality of lower electrodes repeatedly arranged at a first pitch in a first direction and a second direction crossing the first direction at an acute angle on a substrate, and a support pattern in contact with sidewalls of the plurality of lower electrodes and supporting the plurality of lower electrodes. The support pattern includes a first support region having a plurality of openings penetrating the support pattern and a second support region disposed at a periphery of the first support region. The plurality of openings may continuously extend in a zigzag manner, respectively, throughout an entirety of the first support region.