Semiconductor Device Power Supply Wiring Segmentation
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Solution Overview
Problem
Existing semiconductor devices face challenges in improving alternating current (AC) characteristics of IC circuits due to power supply voltage skew between I/O units, leading to timing deviations and increased skew, which affects the reliability and efficiency of data input and output operations.
Innovation Solution
The semiconductor device employs a divided power supply wiring layout, where the VccQ voltage supply line is split into internal and external segments within the I/O units, and the Vss voltage supply line is also divided, using high resistance portions and parasitic resistances to prevent current flow between adjacent units, thereby reducing voltage disturbances and skew.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If power supply wiring is shared between I/O units and other circuits, then device complexity is reduced, but voltage skew and timing deviations increase
Solution Approach 1:
The power supply wiring is segmented into separate regions: a first power supply wiring dedicated to I/O units and a second power supply wiring for other circuits. This segmentation prevents current sharing between different circuit types, eliminating voltage skew and timing deviations while maintaining manageable device complexity through systematic wiring organization.
2Manufacturing precision
If power supply voltage is supplied to multiple I/O units through common wiring, then manufacturing precision requirements are reduced, but voltage disturbances and skew increase
Solution Approach 1:
The invention divides the power supply system into dedicated first and second power supply wirings, where the first wiring serves I/O units and the second wiring serves other circuits. This segmentation ensures that manufacturing variations do not cause voltage disturbances between different circuit types, as their power supply paths are completely separated, thereby maintaining voltage stability without requiring extremely high wiring layout precision.
3Ease of manufacture
If I/O units share common power supply lines, then ease of manufacture is improved, but AC characteristics and data transfer reliability deteriorate
Solution Approach 1:
The power supply wiring is divided into distinct first and second wirings that are separately routed through the semiconductor device. The first wiring connects power supply pads to I/O units, while the second wiring connects to other circuits. This segmentation maintains ease of manufacture through systematic wiring design while eliminating voltage skew and timing deviations that would otherwise degrade AC characteristics and data transfer reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the AC characteristics of the I/O units by minimizing voltage disturbances and reducing skew, leading to improved data transfer efficiency and reliability.
Implementation Method 1
using high resistance portions and parasitic resistances to prevent current flow between adjacent units, thereby reducing voltage disturbances and skew
Data Source
AI summary
A semiconductor device includes pads for inputting and outputting data, a plurality of control circuit groups connected to the pads, a first supply line for supplying a first electric potential to the control circuit groups, and a second supply line for supplying a second electric potential lower than the first electric potential to the control circuit groups. At least one of the first electric potential supply line or the second supply line is provided with a blocking region such that the blocking region prevents supply of the first electric potential, and the first electric potential is supplied to the plurality of control circuit groups from the first supply line divided by the blocking region, or the blocking region prevents supply of the second electric potential, and the second electric potential is supplied to the plurality of control circuit groups from the second supply line divided by the blocking region.