Power Semiconductor Module Pressure Body Design
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Solution Overview
Problem
Existing power semiconductor modules face challenges in ensuring reliable electrical contact between load connection elements and conductor tracks, as these contacts are often rigidly arranged and susceptible to thermal influences and manufacturing tolerances, affecting contact reliability.
Innovation Solution
The power semiconductor module employs a pressure contact design with a pressure body that applies pressure to load connection elements in a homogeneous manner, allowing for flexible arrangement and independent contact reliability, where a pressure body extends through one load connection element to apply pressure to another, ensuring secure contact regardless of thermal influences or manufacturing tolerances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If load connection elements are rigidly arranged, then structural stability is improved, but contact reliability deteriorates due to thermal influences and manufacturing tolerances
Solution Approach 1:
The pressure body is designed to be elastically deformable, allowing it to dynamically adapt to thermal expansion and manufacturing tolerances. The elastic material enables the pressure body to maintain homogeneous contact pressure on all load connection elements despite temperature changes or positional variations, thereby ensuring reliable electrical contact without rigid structural constraints.
Solution Approach 2:
The patent utilizes the elastic properties of the pressure body material to change its physical state under different conditions. The elastic material deforms elastically in response to thermal influences and mechanical stresses, automatically adjusting its shape and pressure distribution to maintain optimal contact with all load connection elements, thus resolving the contradiction between structural stability and contact reliability.
2Reliability
If pressure is applied to multiple load connection elements simultaneously, then contact reliability is improved, but pressure distribution becomes non-uniform due to manufacturing tolerances
Solution Approach 1:
The pressure body is designed with a surface that can locally adapt to the specific geometry and position of each load connection element. The elastic material allows different regions of the pressure body to deform independently, ensuring that each contact point receives appropriate pressure despite variations in load connection element positions caused by manufacturing tolerances, thereby achieving uniform pressure distribution across all contact points.
3Reliability
If load connection elements are arranged at distances from each other, then independence of contact is improved, but pressure application becomes difficult
Solution Approach 1:
The pressure body serves multiple functions simultaneously: it applies pressure to multiple spatially separated load connection elements, provides electrical insulation between them, and compensates for manufacturing tolerances. This single multi-functional component simplifies the overall structure compared to using separate pressure application mechanisms for each load connection element, thereby achieving contact independence without increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures reliable and independent contact security for each load connection element, reducing the impact of thermal influences and manufacturing tolerances on electrical contact, thereby enhancing overall contact reliability and stability.
Implementation Method 1
The pressure body is made of an elastic material and serves the pressure device and the further load connection element at the same time
Data Source
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AI summary
The application relates to a power semiconductor module in a pressure contact configuration, comprising a substrate with power semiconductor components arranged thereon, a housing, externally leading load connection elements, and a pressure device. The substrate has conductive traces with load potential on its first main surface. The load connection elements are each designed as a metal body with a band-like section and contact feet extending from this section. According to the invention, at least one pressure body is arranged between the pressure device and a further load connection element, wherein a part of this pressure body extends through the first load connection element and exerts pressure on a pressure receiving point of the associated further load connection element.