Semiconductor Processing Sheet with Branched Polymer Adhesive
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Solution Overview
Problem
Existing semiconductor-related-member processing sheets face challenges in maintaining the reliability of chips during manufacturing, as increasing the content of free epoxy group-containing compounds to enhance removability can lead to reliability degradation of chip members.
Innovation Solution
A semiconductor-related-member processing sheet with a pressure sensitive adhesive layer containing a polymerizable branched polymer, which improves removability while maintaining chip reliability, by incorporating a polymerizable branched polymer with a branched structure and energy ray polymerizable functional groups, reducing the pressure sensitive adhesive property when irradiated.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the content of free epoxy group-containing compounds is increased to enhance removability, then the removability of the processing sheet is improved, but the reliability of chip members deteriorates
Solution Approach 1:
The patent changes the chemical parameters of the pressure sensitive adhesive by replacing free epoxy group-containing compounds with polymerizable branched polymers having carboxyl groups. This parameter substitution maintains the necessary adhesive properties for chip handling while eliminating the reliability degradation caused by excessive epoxy compounds, thus resolving the contradiction between removability and chip member reliability
Solution Approach 2:
The patent employs a composite adhesive system combining polymerizable branched polymers with carboxyl groups and other compatible adhesive components. This composite material approach achieves optimal balance between removability and reliability by leveraging the synergistic effects of different polymer components, avoiding the harmful effects of high epoxy compound content while maintaining effective adhesion
2Ease of operation
If the pressure sensitive adhesive property is reduced to improve removability, then the force applied to chips during pickup is reduced, but the adhesion strength during processing may be insufficient
Solution Approach 1:
The patent utilizes the dynamic characteristic of polymerizable branched polymers that exhibit pressure sensitivity - the adhesive properties can be dynamically adjusted through polymerization degree and crosslinking. During chip processing, the adhesive maintains sufficient strength, and upon irradiation or heating, the adhesive property reduces to enable easy pickup, thus resolving the contradiction between adhesion strength and pickup suitability
Solution Approach 2:
The patent changes the physical-chemical parameters of the adhesive layer by incorporating polymerizable functional groups that allow controlled modification of adhesive strength. Through controlling the polymerization degree and molecular weight of the branched polymers, the adhesive exhibits appropriate strength during processing then becomes easily removable, balancing adhesion strength and pickup suitability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of a polymerizable branched polymer in the pressure sensitive adhesive layer enhances the removability of the processing sheet, reducing the risk of chip deterioration and maintaining the reliability of chip members, even at lower compound concentrations, thereby preventing cracks and breakage during the manufacturing process.
Implementation Method 1
the pressure sensitive adhesive layer comprises one or more types of energy ray polymerizable compounds having an energy ray polymerizable functional group, wherein at least one type of the energy ray polymerizable compounds is a polymerizable branched polymer
Data Source
AI summary
As a semiconductor-related-member processing sheet which can stably achieve to enhance the removability of the semiconductor-related-member processing sheet and to suppress the reliability degradation of members comprising chips manufactured from a semiconductor-related member using the semiconductor-related-member processing sheet, there is provided a semiconductor-related-member processing sheet, comprising a base material and a pressure sensitive adhesive layer provided on or above one surface of the base material, wherein the pressure sensitive adhesive layer comprises one or more types of energy ray polymerizable compounds having an energy ray polymerizable functional group, wherein at least one type of the energy ray polymerizable compounds is a polymerizable branched polymer that is a polymer having a branched structure, wherein a contact angle on a measurement target surface is 40° or less when measured using a water droplet under an environment of 25° C. and a relative humidity of 50%.