Semiconductor Package Protection Layer for Thin Substrate Processing
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Solution Overview
Problem
The challenge in the electronics industry is to manufacture compact and lightweight semiconductor packages without damaging thin semiconductor chips, which are prone to malfunction or degradation when stacked or processed.
Innovation Solution
A method involving the formation of a protection layer on a substrate to cover semiconductor devices, followed by attaching a support substrate with an adhesive member, and then detaching the support substrate using laser irradiation, while removing portions of the substrate to prevent mechanical stress on the chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If thin semiconductor chips are stacked to fabricate compact packages, then package size is reduced, but chip damage occurs causing malfunction or degradation
Solution Approach 1:
A protection layer is formed on the front surface of the substrate to cover and protect the semiconductor devices before any processing or stacking operations are performed. This pre-established protective barrier prevents damage during subsequent manufacturing steps while allowing the chips to be stacked into compact packages.
Solution Approach 2:
The protection layer acts as an intermediary element between the semiconductor devices and the external environment or processing tools. This intermediate protective structure enables safe handling and stacking of thin chips without direct contact that could cause damage, thus facilitating compact packaging while maintaining chip integrity.
2Ease of manufacture
If support substrate is attached and then detached, then processing is enabled, but mechanical stress is applied to chips
Solution Approach 1:
The protection layer is formed beforehand to cushion and absorb mechanical stress during the attachment and detachment of the support substrate. This pre-established protective barrier prevents stress transmission to the semiconductor devices while enabling necessary processing operations.
Solution Approach 2:
The protection layer serves as an intermediary that decouples the mechanical stress from the support substrate operations. When the support substrate is attached and detached, the protection layer absorbs the mechanical interactions, preventing direct stress application to the vulnerable semiconductor chips.
3Volume of moving object
If substrate is processed to remove portions, then compact packaging is achieved, but structural integrity may be compromised
Solution Approach 1:
The protection layer is formed on the substrate surface before any substrate processing or material removal operations. This pre-established protective barrier maintains structural integrity during processing while allowing the substrate to be thinned or shaped for compact packaging.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively protects semiconductor devices from damage during processing, allowing for the creation of compact and reliable semiconductor packages by reducing mechanical and thermal stress, thereby enhancing the reliability and performance of semiconductor packages.
Implementation Method 1
forming a light-to-heat conversion layer over the first surface of the substrate to cover the bumps and the seed metal layer, attaching a support substrate to the substrate so that an adhesive member is disposed between the light-to-heat conversion layer and the support substrate, irradiating laser beams onto the support substrate to detach the light-to-heat conversion layer, the adhesive member, and the support substrate from the seed metal layer
Data Source
AI summary
Methods of fabricating semiconductor packages are provided. One of the methods includes forming a protection layer including metal on a first surface of a substrate to cover a semiconductor device disposed on the first surface of the substrate, attaching a support substrate to the protection layer by using an adhesive member, processing a second surface of the substrate opposite to the protection layer to remove a part of the substrate, and detaching the support substrate from the substrate.