Semiconductor Layout With Bent RDL Wiring for Stable High-Speed Power
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Solution Overview
Problem
Designing a high-speed circuit for LPDDR memory that efficiently supplies power through a redistribution layer while maintaining low power consumption is challenging, particularly due to overlapping projections of power pads and circuit modules.
Innovation Solution
A semiconductor structure with a high-speed circuit module, a first conductive metal layer, and a redistribution layer, where power conductive wires in the metal layer are arranged at intervals and connected to power pads via repeatedly bent electrical wires in the redistribution layer, ensuring non-overlapping projections and increased contact area for efficient power supply.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If power pads are positioned to supply power to high-speed circuit modules, then power supply capability is improved, but signal interference increases due to overlapping projections
Solution Approach 1:
The patent transitions from a two-dimensional planar layout to a three-dimensional stacked architecture. Power pads are positioned in the redistribution layer above the first conductive metal layer, with power conductive wires extending vertically through via holes to connect power pads with high-speed circuit modules in different layers. This vertical stacking eliminates projection overlap between power pads and circuit modules, reducing signal interference while maintaining power supply capability.
2Power
If power conductive wires are arranged densely to improve power distribution, then power supply efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent segments the power distribution system into multiple independent components: power pads in the redistribution layer, via holes for vertical connections, and power conductive wires in the first conductive metal layer. This segmentation allows each component to be optimized independently - power pads can be positioned for optimal power distribution, via holes provide precise vertical alignment, and power conductive wires can be arranged with appropriate spacing. The modular structure reduces overall manufacturing precision requirements compared to a dense single-layer configuration.
3Object-affected harmful factors
If power pads are positioned away from circuit modules to reduce interference, then signal quality is improved, but power supply efficiency deteriorates
Solution Approach 1:
The patent resolves this contradiction by utilizing the vertical dimension. Power pads are positioned in the redistribution layer above the circuit modules, not in the same plane. This vertical separation eliminates signal interference while the via holes provide direct vertical pathways for power conductive wires to connect power pads with circuit modules. The three-dimensional configuration maintains short power delivery paths, ensuring high power supply efficiency without compromising signal quality.
4Adaptability or versatility
If electrical wires are made long to connect power pads and circuits, then flexibility in layout is improved, but power loss increases
Solution Approach 1:
The patent reduces wire length by utilizing vertical via holes for power connections. Instead of routing power conductive wires horizontally across the substrate, the via holes provide direct vertical pathways from power pads in the redistribution layer to power conductive wires in the first conductive metal layer. This vertical routing significantly shortens the power delivery path, reducing power loss while maintaining layout flexibility through the three-dimensional configuration.
Solution Approach 2:
The patent applies different connection strategies for different functions: vertical via holes are used for power connections to minimize length and power loss, while horizontal electrical wires in the redistribution layer provide flexible routing for signal connections. This localized optimization of connection paths ensures that power delivery paths are as short as possible, minimizing power loss, while signal paths can be routed flexibly to accommodate layout requirements.
Data Source
AI summary
A semiconductor structure includes: a high-speed circuit module including a clock signal with a frequency greater than a first threshold; a first conductive metal layer including power conductive wires extending along a first direction and arranged at intervals, and the power conductive wires being electrically connected with the high-speed circuit module; and a redistribution layer located above the first conductive metal layer and including power pads and electrical wires connected with the power pads, in which the power pads are located at one side of the high-speed circuit module, a projection of the power pads does not overlap with that of the high-speed circuit module, the electrical wires include a first electrical wire region where the electrical wires are repeatedly bent, the first electrical wire region at least partially covers the high-speed circuit module, and the electrical wires are used for electrically connecting the power conductive wires and power pads.