Semiconductor Component With Refractive Polymer Optical Element
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor components face challenges in increasing radiation power emitted during operation, as modifying the semiconductor chip's layer construction or geometry is complex and costly.
Innovation Solution
A semiconductor component incorporating an optoelectronic semiconductor chip with an optical element based on a highly refractive polymer material, applied using a molding compound that is precured at a temperature of at most 50°C, reducing sudden refractive index changes and enhancing radiation power through beam shaping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the semiconductor chip's layer construction or geometry is modified to increase radiation power, then the radiation power emitted is improved, but the device complexity and manufacturing cost increase
Solution Approach 1:
An optical element made of highly refractive polymer material is introduced as an intermediary component between the semiconductor chip and the external environment. This optical element has a refractive index matching the semiconductor material, reducing sudden refractive index changes at interfaces and improving radiation extraction efficiency without requiring modifications to the semiconductor chip's layer construction or geometry.
Solution Approach 2:
The refractive index parameter of the optical element is specifically optimized to match the semiconductor material's refractive index. This parameter change enables reduced total internal reflection and improved radiation extraction without altering the semiconductor chip structure, thereby increasing radiation power while maintaining manufacturing simplicity.
2Power
If the semiconductor chip's layer construction or geometry is modified to increase radiation power, then the radiation power emitted is improved, but the manufacturing cost increases
Solution Approach 1:
The optical element serves as a mediator that can be separately manufactured and then integrated with the semiconductor chip through simple bonding processes. This approach avoids the need for complex and costly modifications to the semiconductor chip fabrication process, thereby reducing manufacturing costs while still achieving improved radiation power.
Solution Approach 2:
The optical element is made from highly refractive polymer material that can be combined with standard semiconductor chip materials. This composite structure allows the use of cost-effective polymer materials with optimized refractive indices to match semiconductor materials, achieving improved radiation extraction without the high costs associated with modifying semiconductor layer constructions.
3Speed
If a molding compound is applied at high temperature to create the optical element, then the curing process is faster, but sudden refractive index changes occur affecting optical quality
Solution Approach 1:
The molding compound is pre-heated to a temperature between 20°C and 50°C before application, which is sufficient to initiate the curing process at a controlled rate. This preliminary heating action allows the curing to proceed without excessive temperature increases, thereby maintaining refractive index uniformity while still achieving practical curing speeds.
Solution Approach 2:
The curing temperature parameter is precisely controlled and limited to a range between 20°C and 50°C during the curing process. This parameter control prevents sudden refractive index changes that would occur with high-temperature curing, while still enabling the molding compound to cure and form the optical element with the required optical quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively increases radiation power emission by up to 16% and allows for reliable, simplified production of semiconductor components with improved optical elements, reducing production costs and enhancing optical quality.
Implementation Method 1
the optical element can make an improved contribution to reducing sudden changes in refractive index between semiconductor chip and surroundings
Implementation Method 2
procuring the molding compound at a temperature of at most 50° C. and curing the molding compound
Data Source
AI summary
A method of producing a semiconductor component includes providing an optoelectronic semiconductor chip; applying a molding compound for an optical element, wherein the molding compound is based on a highly refractive polymer material; precuring the molding compound at a temperature of at most 50° C.; and curing the molding compound.