Semiconductor Refrigeration Chip Packaging to Resist Assembly Overload
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Solution Overview
Problem
Existing semiconductor refrigeration chips have poor overload resistance due to the brittleness of ceramic sheets and semiconductor dies, leading to breakage during assembly and reduced product yield and refrigeration effectiveness.
Innovation Solution
A semiconductor refrigeration chip is manufactured with a packaging structure that covers the side wall of the assembly and defines grooves with insulating and heat-conducting layers, allowing the packaging structure to absorb pressure instead of the fragile components, using materials like polyamide hot melt adhesive for injection molding to enhance durability and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ceramic sheets and semiconductor dies are used in the semiconductor refrigeration chip, then the refrigeration function is achieved, but the brittleness of these materials causes poor overload resistance and breakage during assembly
Solution Approach 1:
The patent applies beforehand cushioning by introducing a rubber sealing ring that surrounds and protects the brittle ceramic sheets and semiconductor dies. This rubber ring acts as a cushioning element that absorbs external pressures and impacts before they can reach the fragile internal components, preventing breakage during assembly and enhancing overload resistance while maintaining the refrigeration function.
2Ease of operation
If the semiconductor refrigeration chip is fixed on the radiator with screws and fixtures, then the refrigeration effect is exerted, but the uneven force causes the ceramic sheets and semiconductor dies to break
Solution Approach 1:
The patent introduces a rubber sealing ring as an intermediary element between the external fixing mechanisms (screws and fixtures) and the internal brittle components. This intermediary absorbs and distributes the uneven forces generated during assembly, preventing direct transmission of harmful stresses to the ceramic sheets and semiconductor dies, thereby enabling secure fixation without breakage.
3Object-affected harmful factors
If 703 or 704 white silicone rubber is used to seal and protect the periphery, then protection is provided, but the protection is insufficient against overload and pressure
Solution Approach 1:
The patent employs composite materials by combining the rubber sealing ring with the ceramic sheets and semiconductor dies within a unified structure. The rubber component provides flexibility and overload resistance, while the ceramic and semiconductor components maintain the refrigeration function. This composite structure achieves both protection against breakage and high overload resistance (withstanding pressures of 1000 PSI or more) that neither material could achieve alone.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves the overload resistance of the semiconductor refrigeration chip, enabling it to withstand pressures of 1000 PSI or more, reducing the risk of breakage during assembly, and maintaining a high product yield and effective refrigeration performance.
Implementation Method 1
the packaging structure covers a side wall of the semiconductor refrigeration assembly and defines a first groove with the first insulating and heat-conducting layer, to obtain the semiconductor refrigeration chip. Therefore, the overload resistance of the semiconductor refrigeration chip can be effectively improved by a simple method, so that the semiconductor refrigeration chip can withstand a pressure of 1000 PSI or more
Implementation Method 2
Semiconductor refrigeration chips are a novel type of refrigerators that achieve the purpose of refrigeration through the Peltier effect. When a direct current passes through a thermocouple formed by two different semiconductor materials connected in series, the two ends of the thermocouple can absorb heat and release heat respectively to realize refrigeration.
Data Source
AI summary
A semiconductor refrigeration chip and a method for manufacturing same are provided. The method includes: providing a semiconductor refrigeration assembly, where the semiconductor refrigeration assembly includes a first insulating and heat-conducting layer and a second insulating and heat-conducting layer provided opposite to each other and a semiconductor layer arranged between the first insulating and heat-conducting layer and the second insulating and heat-conducting layer, a side of the semiconductor refrigeration assembly provided with the first insulating and heat-conducting layer is a cold end, and a side of the semiconductor refrigeration assembly provided with the second insulating and heat-conducting layer is a hot end; and forming a packaging structure, and causing the packaging structure to cover a side wall of the semiconductor refrigeration assembly and define a first groove with the first insulating and heat-conducting layer, to obtain the semiconductor refrigeration chip.