Semiconductor Resin Layer Adhesion and Shielding Design
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Solution Overview
Problem
The existing semiconductor apparatus faces challenges in improving mounting density and effectively blocking electromagnetic waves due to poor adhesion between the sealing resin and conductive films, as well as incomplete shielding of side surfaces, which affects the electrical characteristics of electronic components.
Innovation Solution
A semiconductor apparatus is designed with a resin layer that has higher adhesion to conductive films than the sealing resin, allowing for the formation of conductive patterns and shielding layers on the resin layer, which covers both the upper and side surfaces of the sealing resin, enhancing mounting density and electromagnetic wave blocking accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sealing resin with good shock resistance and durability is used, then the sealing performance is improved, but the adhesion to conductive film becomes poor
Solution Approach 1:
A primer layer is introduced as an intermediary between the sealing resin and the conductive film. The primer layer has high adhesion to both the sealing resin and the conductive film, solving the adhesion problem while maintaining the good sealing performance of the original resin.
Solution Approach 2:
The structure becomes a composite system with three layers: sealing resin layer, primer layer, and conductive film layer. Each layer serves its specific function, and their combination achieves both good sealing performance and strong adhesion.
2Device complexity
If the shielding layer is not disposed on the side surface of the sealing resin, then the manufacturing complexity is reduced, but the electromagnetic wave blocking performance deteriorates
Solution Approach 1:
The shielding structure is extended from a single surface (upper surface only) to multiple surfaces (upper surface and side surfaces). This dimensional extension blocks electromagnetic waves from intruding through side surfaces while maintaining manageable manufacturing complexity.
3Device complexity
If the mounting density is not improved, then the device complexity is reduced, but the performance of electronic equipment deteriorates
Solution Approach 1:
The conductive film pattern is designed to serve multiple functions: it provides electrical connections for mounting electronic components and simultaneously forms shielding structures. This multi-functionality increases mounting density without proportionally increasing device complexity.
Data Source
AI summary
A resin layer in which adhesion to a conductive film is higher than that of a sealing resin to the conductive film is disposed on the sealing resin in which it is difficult to form the conductive film, and wiring patterns electrically connected to electronic components are disposed on the resin layer.