Semiconductor Module Resin Support Structure for Mounting Load Relief
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Solution Overview
Problem
Existing semiconductor devices are prone to mechanical breakage during mounting due to excessive load application, as the support structures do not adequately distribute or alleviate the load, leading to potential damage of circuit elements.
Innovation Solution
A semiconductor device design featuring a substrate with a circuit layer and a first resin body positioned between the substrate and outer electrodes, where the resin body protrudes beyond the electrodes and has a tapered shape to absorb and distribute applied loads, preventing breakage by transferring the load through the resin body and protection layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a support body protrudes from terminal electrodes to receive and disperse load, then mechanical breakage of the electronic component is prevented, but the load may still be transferred to the circuit element causing breakage
Solution Approach 1:
The patent introduces a resin body as an intermediary structure between the support body and the circuit element. This resin body has lower rigidity than the support body, allowing it to act as a load-absorbing intermediary that prevents direct load transfer to the circuit element while still providing mechanical support
Solution Approach 2:
The patent changes the rigidity parameter by using a resin body with lower rigidity compared to the support body. This parameter difference creates a gradient structure where the load is progressively absorbed from the rigid support body through the flexible resin body, preventing sudden load transfer to the circuit element
2Force
If the support body is formed thicker than terminal electrodes to receive load, then the electronic component withstands mounting load, but insufficient load alleviation effect may cause element breakage
Solution Approach 1:
The patent applies local quality by creating different rigidity zones within the support structure. The support body has high rigidity for load reception, while the resin body has low rigidity for load absorption and distribution. This localized differentiation of mechanical properties allows the structure to both bear and alleviate load effectively
3Reliability
If a resin body with tapered shape is introduced between substrate and outer electrodes, then load is distributed and breakage is prevented, but device structure becomes more complex
Solution Approach 1:
The patent merges the resin body with the support body and circuit element into an integrated structure. The resin body is positioned to connect the support body to the outer electrodes, creating a unified load-path structure that provides both mechanical support and load distribution without requiring separate independent components
Data Source
AI summary
A semiconductor device that includes: a substrate having a first main surface and a second main surface opposite to each other in a thickness direction; a circuit layer on the first main surface of the substrate; and a first resin body between an end portion of the substrate and the first outer electrode, and between the end portion of the substrate and the second outer electrode in a plan view in the thickness direction. In the thickness direction, a leading end of the first resin body is positioned higher than top ends of the first and second outer electrodes. In a sectional view, a first side surface of the first resin body approaches a second side surface of the first resin body on a side close to the end portion of the substrate, and the second side surface rises steeply against a first main surface of the substrate.