Semiconductor Manufacturing Resin Layer Peeling via Plasma and Chemical Etching
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current manufacturing methods for semiconductor and display devices face challenges in achieving low-cost, high-productivity, and high-yield processes, particularly in peeling methods that require complex equipment and are not suitable for large-sized substrates or low-temperature operations, while also aiming for reduced power consumption, thickness, weight, flexibility, and reliability.
Innovation Solution
A method involving plasma treatment of a substrate surface, followed by forming a resin layer using a material containing a resin or resin precursor, and then separating the substrate from the resin layer using a water-containing liquid, which reduces adhesion and allows for easy peeling without the need for expensive laser equipment, enabling the use of large-sized substrates and low-temperature processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If laser light irradiation is performed to peel the heat-resistant resin layer from the glass substrate, then the peeling process can be achieved, but the manufacturing cost increases due to expensive laser equipment and the process becomes unsuitable for large-sized substrates
Solution Approach 1:
The patent replaces the laser-based peeling method with a chemical etching method using a specific etchant solution. This substitution eliminates the need for expensive laser equipment while achieving effective peeling of the heat-resistant resin layer from the glass substrate, thereby reducing manufacturing complexity and cost.
Solution Approach 2:
The patent changes the peeling mechanism from thermal/laser-based to chemical-based by using a specifically formulated etchant. This parameter change in the peeling approach allows for cost-effective processing and makes the method suitable for large-sized substrates without the limitations of laser equipment.
2Ease of manufacture
If conventional peeling methods are used, then peeling can be achieved, but the manufacturing cost increases and productivity decreases
Solution Approach 1:
The patent replaces conventional mechanical or laser-based peeling methods with a chemical etching process using a specifically formulated etchant. This substitution enables more efficient peeling operations that can be performed on large-sized substrates, thereby improving manufacturing productivity while reducing costs.
3Manufacturing precision
If high-temperature processing is performed, then the resin layer can be formed and cured, but the substrate and resin layer cannot be easily separated
Solution Approach 1:
The patent changes the chemical composition parameters of the resin layer by incorporating specific functional groups or additives that enable selective etching. This parameter change allows the resin layer to be formed through heat treatment while simultaneously enabling easy separation through chemical etching with the formulated etchant, resolving the contradiction between formation and separation.
Solution Approach 2:
The patent introduces a specific etchant as an intermediary substance that facilitates the separation process. This etchant selectively reacts with the resin layer without damaging the underlying substrate, enabling easy separation after the resin layer has been properly formed and cured through high-temperature processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances peeling efficiency, reduces manufacturing costs, and allows for the production of flexible, lightweight, and reliable display devices with improved yield and reduced power consumption, while eliminating the need for expensive laser-based peeling processes.
Implementation Method 1
a method involving plasma treatment of a substrate surface
Implementation Method 2
forming a resin layer using a material containing a resin or resin precursor, and then separating the substrate from the resin layer
Implementation Method 3
separating the substrate from the resin layer using a water-containing liquid, which reduces adhesion and allows for easy peeling
Data Source
AI summary
The yield of a manufacturing process of a semiconductor device is increased. The mass productivity of the semiconductor device is increased. The semiconductor device is manufactured by performing a step of performing plasma treatment on a first surface of a substrate; a step of forming a first layer over the first surface with the use of a material containing a resin or a resin precursor; a step of forming a resin layer by performing heat treatment on the first layer; and a step of separating the substrate and the resin layer from each other. In the plasma treatment, the first surface is exposed to an atmosphere containing one or more of hydrogen, oxygen, and water vapor.