Semiconductor Device Resin Sealing and Post Electrode Piercing
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Solution Overview
Problem
The challenge in reducing the thickness of semiconductor devices using flip-chip bonding techniques is compounded by difficulties in handling thin semiconductor chips and the Au-Au pressure bonding process, which leads to underfill material adherence and potential damage to the side surfaces of the first semiconductor chip.
Innovation Solution
A semiconductor device structure featuring a first semiconductor chip with a second semiconductor chip flip-chip bonded to it, sealed by a resin portion that exposes the lower surface of the first chip and upper surface of the second chip, while covering the side surface of the first chip, and a post electrode that pierces the resin portion for connection, along with a manufacturing method involving post electrode formation, groove creation, resin sealing, grinding, and polishing to reduce thickness and prevent damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the second semiconductor chip is made thinner to reduce device thickness, then the packaging density is improved, but the handling difficulty increases and the chip is more prone to damage
Solution Approach 1:
The patent applies beforehand cushioning by forming a resin portion that covers the side surface of the first semiconductor chip before the flip-chip bonding process. This resin portion acts as a protective cushion during handling and bonding operations, preventing damage to the thin second semiconductor chip while enabling reduced device thickness
2Strength
If the Au-Au pressure bonding process is used for flip-chip bonding, then the bonding strength is improved, but the underfill material adheres to the bonding tool and the thin chip causes processing difficulties
Solution Approach 1:
The patent introduces an intermediary resin portion that covers the side surface of the first semiconductor chip during the Au-Au pressure bonding process. This resin portion serves as a mediator that prevents underfill material from adhering to the bonding tool while allowing the pressure bonding process to proceed effectively, thus maintaining bonding strength while easing manufacturing difficulties
3Device complexity
If the side surface of the first semiconductor chip is exposed, then the chip structure is simplified, but the chip is vulnerable to damage during testing and packaging
Solution Approach 1:
The patent applies beforehand cushioning by forming a resin portion that covers the side surface of the first semiconductor chip. This resin portion provides protective cushioning during subsequent testing and packaging operations, preventing damage to the chip while maintaining a relatively simple overall structure
Data Source
AI summary
A semiconductor device which includes a first semiconductor chip, a second semiconductor chip flip-chip bonded to the first semiconductor chip, a resin portion for sealing the first semiconductor chip and the second semiconductor chip such that a lower surface of the first semiconductor chip and an upper surface of the second semiconductor chip are exposed and a side surface of the first semiconductor chip is covered, and a post electrode which pierces the resin portion and is connected to the first semiconductor chip, and a manufacturing method thereof are provided.