Semiconductor Resistor Structure With Wave-Like Patterns
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Solution Overview
Problem
Semiconductor devices face challenges in achieving desired resistance with large resistor structures, which occupy significant area, increasing costs and limiting integration with other components.
Innovation Solution
A semiconductor device design featuring a resistor structure with wave-like shaped resistor line patterns on sloped lower patterns, allowing for increased resistance while reducing the overall device size by minimizing the area required for the resistor structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large area is used for the resistor structure to achieve desired resistance, then the resistance value is improved, but the device area increases and integration is limited
Solution Approach 1:
The resistor line pattern is designed to extend in the third direction (vertical direction perpendicular to substrate surface) by having upper and lower surfaces protrude from the substrate. This three-dimensional configuration increases the effective resistance path length without proportionally increasing the footprint area on the substrate, thereby achieving higher resistance values in a compact area.
Solution Approach 2:
The lower patterns are designed with sloped surfaces instead of flat surfaces, creating a wave-like shape when combined with the resistor line pattern. This curved/geometric configuration allows the resistor line to follow a longer path through the protruding structure, increasing the effective resistance length while maintaining a compact footprint on the substrate.
2Reliability
If the resistor structure occupies large area, then desired resistance is achieved, but manufacturing cost increases
Solution Approach 1:
By extending the resistor structure in the vertical dimension with protruding upper and lower surfaces, the effective resistance length is increased without requiring a larger substrate area. This reduces the overall device footprint and allows better integration, thereby reducing manufacturing costs associated with larger device areas.
3Reliability
If the resistor structure occupies large area, then desired resistance is achieved, but device integration is limited
Solution Approach 1:
The three-dimensional resistor structure with vertical protrusions increases the effective resistance path length without requiring additional substrate area. This compact footprint enables better integration with other device components and allows for more versatile device configurations.
Solution Approach 2:
The resistor line pattern is nested within and along the sloped lower patterns, with the resistor line conformally following the wave-like shape. This nested configuration maximizes the use of available space and allows the resistor structure to be integrated within the existing device architecture without requiring additional area.
Data Source
AI summary
A semiconductor device includes a substrate including a resistor region, a plurality of lower patterns in the resistor region, and a resistor line pattern on the plurality of lower patterns and the substrate of the resistor region. The plurality of lower patterns extend in a first direction parallel to a surface of the substrate and are spaced apart from each other in a second direction perpendicular to the first direction and parallel to the surface of the substrate. The resistor line pattern extends in the second direction. The resistor line pattern on the lower patterns has an upper surface and a lower surface protruding in a third direction perpendicular to the surface of the substrate.