Semiconductor Reverse Engineering Protection via Invisible Bias Generators
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Solution Overview
Problem
Existing semiconductor devices are vulnerable to reverse engineering techniques, as their physical geometry reveals their logic functions, allowing unauthorized access to circuit design.
Innovation Solution
The implementation of invisible bias generators (IBGs) with identical geometries but different operating characteristics, such as high and low voltage transistors or silicided and non-silicided resistors, which obscure the logic functions, making it difficult to determine the device's operation through conventional teardown methods.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional semiconductor device design is used, then the device structure is simple and easy to manufacture, but the device is vulnerable to reverse engineering as physical geometry reveals logic functions
Solution Approach 1:
The patent applies parameter changes by introducing invisible bias generators that have identical physical geometries but different electrical characteristics (bias voltages). This changes the electrical parameters of the device while maintaining the same physical structure, making reverse engineering difficult because the geometry no longer reveals the logic function. The bias generators are configured with different threshold voltages or bias levels that are not detectable through physical inspection alone.
Solution Approach 2:
The invisible bias generators act as intermediaries between the physical device structure and the logic function. These bias generators obscure the relationship between geometry and logic function by introducing an intermediate layer of electrical complexity. The bias generators mediate the connection between the visible physical structure and the hidden logic operations, preventing direct inference of logic functions from physical geometry.
2Reliability
If cryptographic techniques are used to protect logic configuration data, then data protection is improved, but the device remains vulnerable to physical reverse engineering teardown techniques
Solution Approach 1:
The patent segments the device into visible structural components and hidden functional components. The invisible bias generators represent the hidden segment that performs critical functions but cannot be identified through physical inspection. This segmentation separates the detectable physical structure from the undetectable logic-determining elements, making teardown techniques ineffective while maintaining data protection.
Solution Approach 2:
The patent changes the detectability parameters of critical device components. By configuring bias generators with electrical parameters (bias voltages, threshold levels) that are invisible to physical inspection methods, the patent makes the critical logic-determining parameters undetectable through conventional teardown techniques, thereby protecting against physical reverse engineering while maintaining cryptographic protection.
3Difficulty of detecting and measuring
If two or more logic devices have identical physical geometry, then reverse engineering difficulty increases, but device manufacturing complexity increases
Solution Approach 1:
The patent applies local quality by introducing subtle local variations in the bias generator configurations while maintaining overall geometric uniformity. The local electrical characteristics (bias voltages, threshold levels) differ between devices with identical global geometries. This allows manufacturing to use standardized processes for the overall structure while introducing localized electrical property variations that prevent reverse engineering.
Solution Approach 2:
The invisible bias generators serve multiple functions: they maintain identical physical geometries for ease of manufacturing while simultaneously providing different logical functions through varied electrical characteristics. This multi-functionality allows the same physical structure to perform different logic operations based on invisible electrical parameters, reducing manufacturing complexity while increasing reverse engineering difficulty.
Data Source
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AI summary
It is desirable to design and manufacture electronic chips that are resistant to modern reverse engineering techniques. Disclosed is a method and device that allows for the design of chips that are difficult to reverse engineer using modern tear down techniques. The disclosed device uses devices having the same geometry but different voltage levels to create different logic devices. Alternatively, the disclosed uses devices having different geometries and the same operating characteristics. Also disclosed is a method of designing a chip using these devices.