Semiconductor Device With Segmented Temperature Detection
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Solution Overview
Problem
Conventional semiconductor devices cannot accurately detect the rapid temperature increase of the transistor and diode parts, leading to potential thermal destruction before overheating is detected.
Innovation Solution
Incorporating a first temperature detection part for the transistor part and a second temperature detection part for the diode part, both strategically positioned within their respective cell regions, allowing for precise temperature monitoring and improved overheating protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If one temperature detection part is used to detect the temperature of the whole semiconductor chip, then the temperature of the chip can be detected, but the rapid temperature increase of the transistor part and diode part cannot be followed
Solution Approach 1:
The single temperature detection part is segmented into multiple temperature detection parts, with each part dedicated to detecting the temperature of specific components (transistor part and diode part). This segmentation allows each detection part to closely monitor the temperature of its corresponding component, enabling accurate detection of rapid temperature increases and improving the overall reliability of the overheat protection function.
2Ease of operation
If a temperature detection part is placed away from the transistor part and diode part, then the overall chip temperature can be monitored, but the localized rapid temperature increase cannot be detected in time
Solution Approach 1:
Temperature detection parts are strategically positioned in close proximity to the transistor part and diode part respectively, allowing each detection part to focus on monitoring the temperature of its corresponding component. This local quality approach ensures that rapid temperature increases are detected immediately at the source, reducing detection response time while maintaining comprehensive temperature monitoring coverage.
Data Source
AI summary
An object is to provide a semiconductor device capable of accurately detecting a temperature of a transistor part and a temperature of the diode part, and improving an overheat protection function. A semiconductor device includes a semiconductor chip having a cell region made up of a plurality of cells including cells corresponding to a transistor part and a diode part, respectively, a temperature detection part detecting a temperature of the transistor part, and a temperature detection part detecting a temperature of the diode part, the temperature detection part is disposed in the cell corresponding to the transistor part, and the temperature detection part is disposed in the cell corresponding to the diode part.