Semiconductor Element With Selective Pad Exposure For Packaging Adaptability

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Solution Overview

Problem

Conventional semiconductor elements are typically designed for a single packaging method, requiring redesign and increased time or cost to adapt for different packaging methods, and existing techniques cannot change pad positions for multiple packaging methods.

Innovation Solution

A semiconductor element comprising a first semiconductor portion with an internal circuit and electrodes, covered by a first insulating layer, and a second semiconductor portion with a wiring layer having two pads, where one pad is exposed and the other covered by a second insulating layer, allowing for flexible pad positioning and packaging method adaptation through the use of rewiring layers and sealing layers.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a semiconductor element is designed for a single packaging method, then the design is simple and focused, but the element cannot be used with other packaging methods without redesign

Engineering Contradiction:

Improvepackaging method adaptabilityVSAvoidelement structure complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The semiconductor element is designed with multiple pads (first pad and second pad) and corresponding insulating layer configurations that enable compatibility with multiple packaging methods (wire bonding, chip scale package, ball grid array). The element can be selectively packaged using different methods without requiring redesign, achieving multi-functionality in packaging adaptability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The insulating layer is configured to expose different pads based on the intended packaging method. By dynamically adjusting which pad is exposed (first pad for wire bonding, second pad for chip scale package or ball grid array), the element adapts to different packaging configurations without structural redesign.

Inventive Principle:

Principle #15Dynamics

2Adaptability or versatility

If the pad position is changed to accommodate a different packaging method, then packaging versatility is improved, but redesign time and cost increase

Engineering Contradiction:

Improvepackaging method flexibilityVSAvoidredesign time

Core Design Contradiction:

Adaptability or versatilityVSLoss of time

Solution Approach 1:

The semiconductor element is pre-designed with multiple pads (first pad and second pad) and the insulating layer is configured to expose different pads based on the intended packaging method. This preliminary configuration of multiple pads allows the element to be adapted to different packaging methods without requiring redesign, thereby reducing redesign time and cost.

Inventive Principle:

Principle #10Preliminary action

3Ease of operation

If the insulating layer exposes the first pad, then wire bonding packaging is enabled, but chip scale package or ball grid array packaging is prevented

Engineering Contradiction:

Improvewire bonding capabilityVSAvoidpackaging method options

Core Design Contradiction:

Ease of operationVSAdaptability or versatility

Solution Approach 1:

Inventive Principle:

Principle #15Dynamics

4Ease of operation

If the insulating layer exposes the second pad, then chip scale package or ball grid array packaging is enabled, but wire bonding packaging is prevented

Engineering Contradiction:

Improvechip scale package capabilityVSAvoidpackaging method options

Core Design Contradiction:

Ease of operationVSAdaptability or versatility

Solution Approach 1:

Inventive Principle:

Principle #15Dynamics

5Adaptability or versatility

If multiple pads are provided with different configurations, then packaging method flexibility is improved, but the risk of unintended connections or short-circuiting increases

Engineering Contradiction:

Improvepackaging method optionsVSAvoidconnection reliability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The insulating layer is selectively configured to expose different pads based on the intended packaging method. By making different parts of the element have different properties (exposed pad vs. covered pad), the element enables specific packaging methods while preventing unintended connections or short-circuiting through the insulating layer's selective exposure configuration.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The insulating layer is configured in advance to prevent unintended connections or short-circuiting by covering pads that should not be exposed for a given packaging method. This preliminary protective action ensures connection reliability while maintaining packaging flexibility.

Inventive Principle:

Principle #9Preliminary anti-action

Data Source

PatentUS8395258B2Semiconductor element, semiconductor device, and fabrication method thereof

Publication Date: 2013.03.12 LAPIS SEMICON CO LTD

AI summary

Semiconductor elements and methods for fabricating semiconductor elements that allow semiconductor elements having the same function to utilize different packaging methods. An exemplary semiconductor element includes a first semiconductor element portion, including an internal circuit, electrodes electrically connected to the internal circuit, and a first insulating layer covering the internal circuit while exposing the electrodes; and a second semiconductor element portion electrically connected to the electrodes and formed on the first insulating layer, the second semiconductor element portion including a wiring layer having a first pad and a second pad, and a second insulating layer configured to cover either one of the first pad or the second pad while exposing the other one of the first pad and the second pad.