Self-Aligned Semiconductor Fabrication via Hydrophobic-Hydrophilic Surface Energy

Solution Overview

Problem

Current methods for fabricating semiconductor devices with variable resistance layers require complex processes like photolithography and etching, which are costly and prone to etch damage, and do not simplify the formation of micro patterns effectively.

Innovation Solution

A method involving the formation of hydrophobic and hydrophilic surfaces to self-align particles and layers without external energy, allowing for the creation of micro patterns and variable resistance elements without photolithography or etching, using hydrophilic particles to expose and isolate conductive and resistance layers sequentially.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If photolithography and etching processes are used to form micro patterns, then manufacturing precision can be achieved, but device complexity and fabrication cost increase

Engineering Contradiction:

Improvemicro pattern formation precisionVSAvoidfabrication process complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent employs self-aligned fabrication where previously deposited layers automatically serve as alignment references for subsequent layers, eliminating the need for photolithography alignment steps. The hydrophobic-hydrophilic surface property differences enable automatic self-alignment of material layers without external guidance patterns

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The patent replaces the mechanical/chemical photolithography and etching system with a surface property-based self-assembly system. Hydrophobic-hydrophilic surface energy differences drive automatic material segregation and alignment, substituting complex photolithographic machinery with simple surface chemistry effects

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Manufacturing precision

If photolithography and etching processes are used to form micro patterns, then manufacturing precision can be achieved, but fabrication cost increases

Engineering Contradiction:

Improvemicro pattern formation precisionVSAvoidfabrication cost

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent employs self-aligned fabrication where previously deposited layers automatically serve as alignment references for subsequent layers, eliminating the need for photolithography alignment steps. The hydrophobic-hydrophilic surface property differences enable automatic self-alignment of material layers without external guidance patterns

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The patent replaces the mechanical/chemical photolithography and etching system with a surface property-based self-assembly system. Hydrophobic-hydrophilic surface energy differences drive automatic material segregation and alignment, substituting complex photolithographic machinery with simple surface chemistry effects

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Manufacturing precision

If etching processes are used to form micro patterns, then micro patterns can be created, but etch damage occurs to the layers

Engineering Contradiction:

Improvemicro pattern formationVSAvoidetch damage to layers

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent employs self-aligned fabrication where previously deposited layers automatically serve as alignment references for subsequent layers, eliminating the need for photolithography alignment steps. The hydrophobic-hydrophilic surface property differences enable automatic self-alignment of material layers without external guidance patterns

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The patent replaces the mechanical/chemical photolithography and etching system with a surface property-based self-assembly system. Hydrophobic-hydrophilic surface energy differences drive automatic material segregation and alignment, substituting complex photolithographic machinery with simple surface chemistry effects

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach simplifies the fabrication process, reduces costs, and prevents etch damage by forming micro patterns without photolithography or etching, enabling efficient production of semiconductor devices with variable resistance elements that switch between resistance states based on applied voltage or current.

Implementation Method 1

forming first lines having a hydrophobic surface extending parallel to each other in a direction between first insulation layers having a hydrophilic surface; self-aligning hydrophilic particles over the first insulation layers to expose portions of the first lines at predetermined intervals

Methodology Applied

Scientific EffectHydrophobic-hydrophilic interaction: Wetting

Data Source

PatentUS9105575B2Method for fabricating a semiconductor device

Publication Date: 2015.08.11 SK HYNIX INC

AI summary

A method for fabricating a semiconductor device includes: forming first lines having a hydrophobic surface extending parallel to each other in a direction between first insulation layers having a hydrophilic surface; self-aligning hydrophilic particles over the first insulation layers to expose portions of the first lines at predetermined intervals; forming a plurality of variable resistance elements over the exposed portions of the first lines; and removing the particles.