Semiconductor Device Series Chip Connection via Single Insulated Substrate
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Solution Overview
Problem
Existing semiconductor devices with complex configurations experience increased power loss and manufacturing costs due to the connection of two semiconductor chips via multiple insulated substrates, which complicates the circuit structure.
Innovation Solution
A semiconductor device configuration where two semiconductor chips are connected in series using a single insulated substrate with inner and outer conductor layers, eliminating the need for additional substrates or power terminals in the connection path, thereby simplifying the circuit and reducing power loss, while maintaining effective insulation by using independent substrates for enhanced voltage handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If two semiconductor chips are connected via multiple insulated substrates and power terminals, then the connection path is established, but the circuit structure becomes complicated and power loss increases
Solution Approach 1:
The patent merges multiple insulated substrates into a single integrated substrate structure. The first and second insulated substrates are combined into one substrate that provides both insulation functions and power terminal connections, eliminating the need for separate substrates and reducing circuit complexity while minimizing power loss paths.
Solution Approach 2:
The integrated insulated substrate performs multiple functions simultaneously: it provides electrical insulation between chips, serves as a mechanical support structure, and acts as a power terminal connection path. This multi-functionality reduces the number of separate components needed and simplifies the overall circuit structure.
2Reliability
If multiple insulated substrates are used to connect two semiconductor chips, then insulation is provided, but manufacturing cost increases
Solution Approach 1:
The patent combines multiple insulated substrates into a single integrated substrate that maintains the required insulation properties while reducing the total number of components. This reduction in component count directly lowers manufacturing costs associated with assembling multiple separate substrates.
Solution Approach 2:
The integrated insulated substrate uses composite material structures that provide high insulation performance while being cost-effective to manufacture. The substrate incorporates insulating materials with optimized properties to maintain reliability without requiring multiple separate components.
3Device complexity
If a single insulated substrate is used to connect two semiconductor chips, then the configuration is simplified, but insulation effectiveness may be reduced due to voltage between substrates
Solution Approach 1:
The patent merges multiple substrates into one integrated structure that maintains effective insulation through internal design features. The single substrate incorporates layered insulating structures and optimized conductor layer arrangements that provide sufficient insulation even under high voltage conditions.
Solution Approach 2:
The integrated substrate employs local quality variations in its structure, with different regions having different insulating properties optimized for their specific functions. High-voltage regions have enhanced insulation structures, while low-voltage regions use standard insulation, providing effective insulation overall while maintaining configuration simplicity.
Data Source
AI summary
A semiconductor device may include a first insulated substrate, a first semiconductor chip and a second semiconductor chip disposed on the first insulated substrate, a second insulated substrate opposed to the first insulated substrate with the first semiconductor chip interposed therebetween, and a third insulated substrate opposed to the first insulated substrate with the second semiconductor chip interposed therebetween and located side by side with the second insulated substrate.