Semiconductor Shield Layer Grounding Cut Plane
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Solution Overview
Problem
Semiconductor devices in portable communication devices experience leakage of electromagnetic energy, which interferes with communication characteristics, and existing shielding methods are inadequate in effectively suppressing this leakage.
Innovation Solution
A semiconductor device configuration that includes a substrate with wiring layers, semiconductor chips, bonding wires, and a conductive shield layer, where the grounding wire's cut plane is electrically connected to the shield layer, increasing the surface area of contact to reduce electromagnetic energy leakage. The shield layer covers the sealing resin and substrate sides, and the grounding wire is made of materials like copper, silver, or nickel to enhance electrical connectivity and reduce electromagnetic interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conductive shield layer is provided along outside surfaces of a sealing resin layer, then electromagnetic energy leakage is suppressed, but the connection reliability at cut edges deteriorates due to exposure and oxidation of wiring layer ends
Solution Approach 1:
The patent applies preliminary action by forming a protective coating on the wiring layers before cutting, and by designing the cut plane structure to expose a larger area of the grounding wire. This pre-preparation ensures that when the substrate is cut and the shield layer is formed, the grounding wire is already positioned to provide both electromagnetic shielding and reliable electrical connection without subsequent oxidation or connection failures
Solution Approach 2:
The patent applies local quality by making the cut plane of the grounding wire have a larger exposed area compared to other wiring layers. This localized structural modification at the cut edge ensures that the grounding wire provides sufficient electrical connection area with the shield layer, while other wiring layers maintain their normal structure. The selective enhancement of grounding wire exposure at the cut plane resolves the contradiction between shielding effectiveness and connection reliability
2Productivity
If the substrate is cut to separate semiconductor devices, then device fabrication is completed, but the ends of wiring layers are exposed and fail to provide sufficient electrical connection area with the shield layer
Solution Approach 1:
The patent makes the cut plane of the grounding wire larger than the cut planes of other wiring layers by adjusting the wiring layer structure before cutting. This localized structural modification ensures that when the substrate is cut, the grounding wire exposes a larger area at the cut edge, providing sufficient electrical connection area with the shield layer that forms afterward, thus resolving the contradiction between completing device fabrication and maintaining adequate connection area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced electrical connection between the shield layer and grounding wire effectively suppresses electromagnetic energy leakage, improving communication characteristics by increasing the surface area of contact and using materials with low resistivity to minimize interference.
Implementation Method 1
a semiconductor package including an electromagnetic shield is applied over the active semiconductor components of the device. An example of a shielded semiconductor package is packaging including a conductive shield layer provided along outside surfaces of a sealing resin layer
Implementation Method 2
The area of the cut plane of the grounding wire is larger than an area of a cross section of the grounding wire parallel to the cut plane of the grounding wire, i.e., the cross sectional area of the grounding wire immediately inward of the location of the cut plane is smaller than that of the grounding wire it the edge of the substrate
Data Source
AI summary
A semiconductor device includes a conductive shield layer that has a first portion covering a surface of a sealing resin layer and a second portion covering side surfaces of the sealing resin layer and side surfaces of the substrate. Portions of wiring layers, including a grounding wire, on or in the substrate have cut planes which are exposed to the side surfaces of the substrate and spread out in a thickness direction of the substrate. A cut plane of the grounding wire is electrically connected to the shield layer. An area of the cut plane of the grounding wire is larger than an area of a cross section of the grounding wire parallel to, and inward of the substrate from, the cut plane of the grounding wire.