Semiconductor Package Shielding Metal Balls Height
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Solution Overview
Problem
High-density semiconductor packaging faces challenges with mutual electromagnetic interference between dies and external electromagnetic signals, leading to potential damage and malfunction, while maintaining electromagnetic compatibility and preventing excessive electromagnetic radiation emission.
Innovation Solution
A semiconductor package design incorporating shielding metal elements, such as metal balls, arranged between and around semiconductor dies to effectively shield electromagnetic interference, with a heat spreader and molding compound enhancing heat dissipation and structural strength without increasing the package height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If shielding structures are added to semiconductor packages to protect against electromagnetic interference, then electromagnetic shielding capability is improved, but package height increases
Solution Approach 1:
The patent embeds shielding metal balls within the existing package structure, nesting them between the substrate and semiconductor dies, and around the periphery of dies. This nested arrangement provides electromagnetic shielding without adding to the overall package height, as the shielding elements are integrated into the vertical stacking arrangement rather than extending beyond it.
Solution Approach 2:
The patent transitions from traditional planar shielding structures to three-dimensional shielding using metal balls arranged in multiple positions (between adjacent dies and around outer peripheries). This spatial redistribution in three dimensions provides comprehensive shielding coverage while maintaining the same vertical footprint, effectively utilizing dimensional space without increasing package height.
2Productivity
If high-density packaging with multiple dies is used to increase productivity, then productivity is improved, but electromagnetic interference between dies worsens
Solution Approach 1:
The patent divides the shielding function into multiple discrete metal ball elements positioned at specific locations between and around individual dies. This segmentation allows each die to be independently shielded from its neighbors, preventing mutual electromagnetic interference while maintaining high packaging density. The segmented shielding approach targets interference sources locally rather than requiring a monolithic shielding structure.
Solution Approach 2:
The shielding metal balls act as intermediary elements positioned between adjacent semiconductor dies. These intermediary metal balls block electromagnetic fields from propagating directly from one die to another, serving as mediators that prevent harmful interactions while allowing the dies to maintain their high-density arranged configuration.
3Object-affected harmful factors
If shielding metal elements are added to shield electromagnetic interference, then electromagnetic shielding capability is improved, but device complexity increases
Solution Approach 1:
The patent employs simple metal balls as shielding elements rather than complex continuous shielding structures. These discrete metal ball elements are inexpensive, easy to position, and simple in form. Their simplicity in geometry and ease of integration reduce manufacturing complexity compared to traditional planar or cylindrical shielding structures, making the shielding function achievable with minimal added complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced electromagnetic interference shielding without increasing the package height, while improving heat dissipation efficiency and structural strength, effectively addressing electromagnetic compatibility issues and ensuring stable operation.
Implementation Method 1
The shielding metal elements, preferably in the form of metal balls, are provided on the upper surface of the substrate, and are arranged between and around the semiconductor dies so that each semiconductor die is surrounded by the shielding metal elements and thus electromagnetic interference in the horizontal direction can be effectively shielded from each semiconductor die.
Data Source
AI summary
A semiconductor package with electromagnetic shielding capabilities is disclosed. The semiconductor package includes a substrate (101), a plurality of semiconductor dies (102), a plurality of shielding metal elements (103), a plurality of grounding metal elements (104) and a plurality of conductive metal elements (110). The semiconductor dies are disposed on an upper surface (105) of the substrate along a horizontal direction. The shielding metal elements are provided on the upper surface of the substrate, and are arranged between and around the semiconductor dies so that each semiconductor die is surrounded by the shielding metal elements and thus electromagnetic interference in the horizontal direction can be effectively shielded from each semiconductor die.