Semiconductor Device Non-Uniform Solder Thickness
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Solution Overview
Problem
The existing semiconductor devices face a challenge in improving heat dissipation properties due to the formation of shrinkage cavities in thin solder layers, which deteriorate the heat conduction and overall performance, while thickening the solder to prevent cavities hampers further heat dissipation enhancement.
Innovation Solution
A semiconductor device design featuring a metal base plate with disposition areas offset from the center, where the solder thickness varies such that edge portions are thicker than those near the center, preventing shrinkage cavity formation and maintaining heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the solder is made thin to improve heat dissipation, then the heat dissipation property is improved, but a shrinkage cavity is formed inside the solder which deteriorates heat conduction
Solution Approach 1:
The solder layer is designed with non-uniform thickness, where edge portions are thicker than central portions. This local variation in thickness allows different regions to serve different functions: thicker edges prevent cavity formation while thinner centers reduce thermal resistance, resolving the contradiction between heat dissipation and heat conduction reliability.
Solution Approach 2:
The thickness parameter of the solder layer is changed from uniform to non-uniform distribution. By controlling the thickness parameter to vary spatially (thicker at edges, thinner at center), the patent simultaneously achieves cavity prevention and optimal heat dissipation, resolving the technical contradiction.
2Reliability
If the solder is made thick to prevent shrinkage cavity formation, then the reliability is improved, but the heat dissipation property cannot be improved
Solution Approach 1:
Instead of uniformly thickening the solder, the patent applies local quality by making only the edge portions thicker. This localized thickening is sufficient to prevent cavity formation during soldering, while the central portions remain thin to maintain good heat dissipation properties.
Solution Approach 2:
The patent applies partial action by thickening only the necessary edge portions of the solder rather than the entire solder layer. This partial thickening provides sufficient cavity prevention capability while minimizing the impact on heat dissipation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses the formation of shrinkage cavities and maintains the heat dissipation properties of the semiconductor device, ensuring stable operation and reliability by allowing the solder to compensate for volume shrinkage without increasing thermal resistance.
Implementation Method 1
the solder having two edge portions of which one is closer than the other to the central portion of the metal base plate, said one being thicker than said the other... allowing the solder to compensate for volume shrinkage
Implementation Method 2
heat generated by a semiconductor element is transmitted from a board to the metal base plate and is dissipated... the heat conduction property of the solder
Data Source
AI summary
A semiconductor device, including a metal base plate having a front surface on which a disposition area is set apart from a central portion of the metal base plate, and a board placed over the disposition area with a solder therebetween. The solder has two edge portions of which one is closer than the other to the central portion of the metal base plate, said one being thicker than said the other.