Semiconductor Apparatus Source Electrode Terminal Segmentation
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Solution Overview
Problem
Semiconductor devices capable of conducting large currents face reliability issues due to unstable bonding wire connections, which are exacerbated by the need for increased wire post size and number of bonding wires, leading to potential disconnection and reduced reliability.
Innovation Solution
The semiconductor apparatus incorporates a source electrode terminal with multiple leads extending from a wire post to provide stable support for bonding wires, increasing the strength and reliability of connections by securing the wire post at both ends, thereby improving the apparatus' ability to conduct high currents.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the wire post size and number of bonding wires are increased to conduct large currents, then the current conduction capability is improved, but the connection stability deteriorates due to potential disconnection
Solution Approach 1:
The source electrode terminal is divided into multiple leads (first lead and second lead) that extend from opposite ends of the wire post, creating multiple support points. This segmentation provides stable support for multiple bonding wires while maintaining connection reliability under large current conditions.
2Power
If multiple bonding wires are used to conduct large currents, then the current conduction capability is improved, but the device complexity increases
Solution Approach 1:
The wire post serves multiple functions: it acts as a structural support element, an electrical conductor for large currents, and a mounting platform for multiple bonding wires. The leads extending from the wire post provide both mechanical support and electrical connection functions, reducing the need for separate components.
3Reliability
If the wire post is secured at both ends with leads, then the connection stability is improved, but the device complexity increases
Solution Approach 1:
The leads are integrated directly with the wire post, forming a unified source electrode terminal structure. The leads extend from the ends of the wire post and are molded together with the resin, creating a combined structural element that provides support without requiring separate fastening components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reliability and stability of the semiconductor apparatus by securely connecting bonding wires, allowing for the reliable conduction of large currents while maintaining a compact size and efficient heat dissipation.
Implementation Method 1
The source electrode pad of the semiconductor device and the wire post of the source electrode terminal are connected to each other through a plurality of bonding wires
Implementation Method 2
the semiconductor device, a surface, supporting the semiconductor device thereon, of the drain electrode terminal, the wire post of the source electrode terminal, the bonding wires, and part of the gate electrode terminal are covered with a mold resin
Data Source
AI summary
A semiconductor device, a drain electrode terminal supporting the semiconductor device and connected directly to a drain electrode pad, a source electrode terminal connected to a source electrode pad, and a gate electrode terminal are provided, wherein the source electrode terminal includes a wire post, a first lead extending from one end of the wire post, and a second lead extending from another end of the wire post, wherein the source electrode pad and the wire post of the source electrode terminal are connected to each other through a plurality of bonding wires, and wherein the semiconductor device, a surface, supporting the semiconductor device thereon, of the drain electrode terminal, the wire post of the source electrode terminal, the bonding wires, and part of the gate electrode terminal are covered with a mold resin.