Semiconductor Device Thermal Isolation via Spacer Gaps

The patent introduces a vertical spacing dimension between the printed circuit board and main circuit board by using spacers. Instead of arranging components in a flat plane, the solution creates a three-dimensional structure where the printed circuit board is positioned at a different vertical level, thereby reducing thermal conduction while maintaining compact horizontal footprint.

The spacers act as intermediary elements between the main circuit board and printed circuit board. These spacers physically separate the two boards and serve as thermal barriers, preventing direct heat conduction from the semiconductor chip to the control ICs while still allowing structural support and electrical connection.

The patent extracts and eliminates the bonding material from the assembly process. Instead of using adhesive or solder to attach the printed circuit board to the case, the design relies on the mechanical interference fit between the spacers and the case structure, thereby removing the need for additional bonding materials and simplifying manufacturing.

The spacers are designed to automatically provide both mechanical support and thermal isolation functions without requiring additional bonding materials. The self-aligning and self-supporting features of the spacer structure enable the assembly to be completed through simple insertion, making the system self-sufficient and eliminating complex bonding processes.