Semiconductor Stack Test Diode Circuits for Bonding Defect Detection

The patent replaces manual mechanical X-Ray analysis with an automated electrical test system that uses current paths and diode circuits to detect interconnect defects. This substitution of measurement methodology eliminates the time-consuming manual inspection process while maintaining defect detection capability through electrical characterization of the inter-die connections.

The patent implements a self-test capability where the semiconductor device uses its own integrated diode circuits and current paths to automatically verify interconnect health. This self-service approach eliminates the need for external manual X-Ray analysis, providing immediate feedback on inter-die connection quality without requiring separate verification equipment or personnel.

The patent performs the interconnect verification action during the bonding process itself rather than after completion. By integrating the electrical test into the manufacturing flow and using the bonding equipment to characterize current paths, the verification happens preliminarily before the device leaves the production line, eliminating the week-long delay associated with post-packaging BIST data analysis.

The patent establishes real-time feedback loops where test results from diode circuit characterization are immediately available to operators during the bonding process. This feedback mechanism allows for immediate process adjustments and eliminates the delayed feedback inherent in traditional BIST approaches, enabling same-day or same-shift verification and correction.