Semiconductor Substrate Conducting Layer Sidewall Formation
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Solution Overview
Problem
Conventional chip packaging processes are costly and time-consuming due to multiple patterning and material deposition processes.
Innovation Solution
A simplified chip packaging method involving a semiconductor substrate with a device or sensing region, a conducting pad, and an insulating layer, where a conducting layer is formed from the upper surface to the sidewall of the substrate, reducing the need for extensive patterning and allowing for wafer-scale packaging with fewer processing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional manufacturing processes with multiple patterning and material deposition are used, then manufacturing precision can be maintained, but fabrication time and cost increase significantly
Solution Approach 1:
The patent combines multiple patterning and material deposition processes into a single integrated step where the conducting layer is formed to extend from the upper surface to the sidewall of the semiconductor substrate. This merging of processes reduces the total number of fabrication steps while maintaining the necessary electrical connections and structural integrity, thereby improving productivity without sacrificing manufacturing precision.
Solution Approach 2:
The conducting layer is designed to extend in multiple dimensions - from the upper surface vertically down to the sidewall of the semiconductor substrate. This three-dimensional configuration allows a single layer to perform multiple functions that would traditionally require separate processing steps, including electrical connection, structural support, and potential heat dissipation, thus reducing overall fabrication complexity and time.
2Manufacturing precision
If multiple patterning processes are used, then electrical connections can be precisely formed, but the number of processing steps increases
Solution Approach 1:
The patent merges multiple patterning operations into a single conducting layer formation process. The conducting layer is configured to extend from the upper surface to the sidewall in one integrated step, eliminating the need for separate patterning and deposition steps that would traditionally be required to achieve the same electrical connections.
Solution Approach 2:
The conducting layer serves multiple functions simultaneously - providing electrical connection from the pad to external contacts, forming structural boundaries, and potentially serving as a shielding layer. This multi-functionality reduces the number of specialized processing steps needed while maintaining precise electrical connections.
3Reliability
If extensive material deposition is performed, then reliable electrical connections are achieved, but fabrication cost increases
Solution Approach 1:
The patent combines material deposition with the conducting layer formation in a single process step. The conducting layer is deposited and patterned simultaneously to extend from the upper surface to the sidewall, eliminating the need for multiple separate deposition cycles and associated alignment and processing steps, thereby reducing fabrication cost while maintaining reliable electrical connections.
Data Source
AI summary
An embodiment of the invention provides a chip package which includes: a carrier substrate; a semiconductor substrate having an upper surface and a lower surface, disposed overlying the carrier substrate; a device region or sensing region located on the upper surface of the semiconductor substrate; a conducting pad located on the upper surface of the semiconductor substrate; a conducting layer electrically connected to the conducting pad and extending from the upper surface of the semiconductor substrate to a sidewall of the semiconductor substrate; and an insulating layer located between the conducting layer and the semiconductor substrate.