Semiconductor Substrate Metallic Baseplate Thermal Dissipation

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Solution Overview

Problem

Current substrate structures for semiconductor integrated circuits, particularly power modules, face challenges in efficiently routing components and dissipating heat without the use of wire bonds or clips, while also requiring effective thermal and electrical performance.

Innovation Solution

The implementation of substrate structures featuring metallic baseplates with varying thickness metallic traces and insulative layers, including ceramic and laminate materials, which allow for direct bonding and patterning to facilitate thermal dissipation and electrical routing without wire bonds or clips, using techniques such as photoresist patterning and nickel plating to create multiple thickness traces and patterns.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If wire bonds or clips are used for electrical interconnection, then ease of manufacture is improved, but device complexity and stress on substrate increase

Engineering Contradiction:

Improveease of manufactureVSAvoiddevice complexity

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent merges the functions of electrical interconnection and thermal management into a single integrated substrate structure. The metallic baseplate with embedded traces eliminates the need for separate wire bonds and clips, combining multiple functions (electrical routing, mechanical support, thermal dissipation) into one unified structure that reduces overall device complexity while maintaining ease of manufacture.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The invention extracts and eliminates the unnecessary wire bonds and clips from the traditional semiconductor packaging structure. By using direct metallic traces integrated into the substrate, the patent removes these separate interconnection elements, reducing device complexity and stress points while simplifying the manufacturing process.

Inventive Principle:

Principle #2Taking out (Extraction)

2Ease of manufacture

If uniform thickness metallic traces are used, then ease of manufacture is improved, but thermal dissipation efficiency deteriorates

Engineering Contradiction:

Improveease of manufactureVSAvoidthermal dissipation efficiency

Core Design Contradiction:

Ease of manufactureVSTemperature

Solution Approach 1:

The patent applies local quality by varying the thickness of metallic traces according to their specific functional requirements. Different regions of the substrate have traces of different thicknesses - thicker traces in areas requiring higher current carrying capacity or thermal dissipation, and thinner traces where electrical routing is sufficient. This localized optimization improves thermal dissipation efficiency while remaining compatible with standard manufacturing processes.

Inventive Principle:

Principle #3Local quality

3Reliability

If ceramic insulative layers are used, then electrical insulation performance is improved, but manufacturing complexity and cost increase

Engineering Contradiction:

Improveelectrical insulation performanceVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent makes the metallic baseplate multi-functional by integrating both electrical interconnection (through traces) and thermal management (through the baseplate's thermal mass and conductivity) into a single component. This universal structure eliminates the need for separate ceramic insulative layers in many applications, reducing manufacturing complexity while maintaining adequate electrical insulation through the substrate design itself.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables efficient thermal dissipation and electrical interconnection within semiconductor packages, enhancing performance and reducing stress on the substrate, while eliminating the need for wire bonds or clips, thereby improving the overall efficiency and reliability of power electronic substrates.

Implementation Method 1

a metallic baseplate having a first surface and a second surface opposing the first surface

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a first insulative layer having a first surface coupled to the second surface of the metallic baseplate

Methodology Applied

Scientific EffectElectrical insulation: Dielectric

Implementation Method 3

a first plurality of metallic traces, each metallic trace of the first plurality of metallic traces coupled to the second surface of the electrically insulative layer

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS20220375833A1Substrate structures and methods of manufacture

Publication Date: 2022.11.24 SEMICON COMPONENTS IND LLC

AI summary

Implementations of semiconductor packages may include a metallic baseplate, a first insulative layer coupled to the metallic baseplate, a first plurality of metallic traces, each metallic trace of the first plurality of metallic traces coupled to the electrically insulative, one or more semiconductor devices coupled to each one of the first plurality of metallic traces, a second plurality of metallic traces coupled to the one or more semiconductor devices, and a second insulative layer coupled to the metallic traces of the second plurality of metallic traces.