Semiconductor Substrate with Recessed Conductive Traces
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Solution Overview
Problem
The semiconductor industry faces challenges in weight reduction and miniaturization, leading to manufacturing issues such as low yield due to the difficulty in handling thin semiconductor substrates with embedded conductive traces.
Innovation Solution
A semiconductor substrate structure comprising a conductive structure and a dielectric structure formed from a cured photo-sensitive resin, where the dielectric structure covers the conductive structure and defines openings to expose conductive surfaces, ensuring the conductive surfaces are either coplanar or recessed within the dielectric, enhancing handling and manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If a thin semiconductor substrate with one layer of embedded conductive traces is used for weight reduction and miniaturization, then weight and size are reduced, but manufacturing yield decreases due to difficulty in handling
Solution Approach 1:
The patent uses a composite structure consisting of a thin semiconductor substrate combined with a support structure comprising a dielectric layer and a carrier. The dielectric layer is formed from a cured photo-sensitive resin that provides mechanical support while allowing electrical connections. This composite structure maintains the weight benefits of the thin substrate while improving handling characteristics and manufacturing yield through the added structural support.
2Volume of moving object
If a thin semiconductor substrate with one layer of embedded conductive traces is used for miniaturization, then size is reduced, but manufacturing yield decreases due to difficulty in handling
Solution Approach 1:
The patent employs a composite structure where a thin semiconductor substrate is combined with a support structure including a dielectric layer formed from cured photo-sensitive resin and a carrier. This composite approach maintains the miniaturization benefits while the additional layers provide mechanical strength and ease of handling during manufacturing processes, thereby improving manufacturing yield.
Solution Approach 2:
The patent divides the semiconductor structure into separate functional layers: the thin semiconductor substrate containing conductive traces, a dielectric layer formed from photo-sensitive resin, and a carrier structure. This segmentation allows each layer to be optimized independently - the substrate for miniaturization and the support structures for handling and manufacturing yield.
3Ease of manufacture
If the conductive surface protrudes from the dielectric surface, then electrical connections are simplified, but the structure becomes more vulnerable to damage during handling
Solution Approach 1:
The patent embeds the conductive traces within the dielectric layer structure, with the dielectric material surrounding and protecting the conductive elements. The dielectric layer is formed from cured photo-sensitive resin that encapsulates the conductive traces, providing mechanical protection while maintaining electrical connection capabilities through controlled openings or contact points.
4Reliability
If expensive underfills are used to protect thin substrates, then structural reliability improves, but manufacturing cost increases
Solution Approach 1:
The patent makes the dielectric layer itself perform the protective function that would otherwise require separate underfill materials. The cured photo-sensitive resin provides mechanical support, structural reliability, and protection for the thin substrate and conductive traces, eliminating the need for additional expensive underfill materials while maintaining all necessary protective functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the handling and manufacturing yield of thin semiconductor substrates by providing a robust and reliable structure that reduces the risk of damage during processing, allowing for efficient encapsulation and electrical connections without the need for expensive underfills.
Implementation Method 1
The dielectric structure includes, or is formed from, a cured photo-sensitive resin
Data Source
AI summary
The present disclosure relates to a semiconductor substrate structure, semiconductor package and method of manufacturing the same. The semiconductor substrate structure includes a conductive structure and a dielectric structure. The conductive structure has a first conductive surface and a second conductive surface opposite to the first conductive surface. The dielectric structure covers at least a portion of the conductive structure, and has a first dielectric surface and a second dielectric surface opposite to the first dielectric surface. The first conductive surface does not protrude from the first dielectric surface, and the second conductive surface is recessed from the second dielectric surface. The dielectric structure includes, or is formed from, a photo-sensitive resin, and the dielectric structure defines a dielectric opening in the second dielectric surface to expose a portion of the second conductive surface.