Semiconductor Substrate Robot With Linear Arms for Stacked Modules
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Solution Overview
Problem
The semiconductor manufacturing industry faces challenges in achieving higher equipment throughput at lower costs and reducing the footprint of semiconductor processing systems, necessitating the development of tool robots that can handle wafer tasks efficiently and reach higher elevations without increasing complexity or cost.
Innovation Solution
A robot apparatus with a support structure and two movable arms, each equipped with end effectors, is designed to move along perpendicular and parallel axes, eliminating the need for rotational axes, allowing it to interact with multiple stacks of process modules without rotating, thus simplifying the robot design and increasing reach.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If traditional robot designs with rotational axes are used to reach higher process modules, then vertical reach is improved, but device complexity increases
Solution Approach 1:
The robot is divided into multiple arms (first arm and second arm) that can move independently along parallel axes, eliminating the need for a single complex rotational mechanism. Each arm has its own drive mechanism, allowing simplified linear motion control instead of complex rotational coordination.
Solution Approach 2:
The invention transitions from rotational movement (angular dimension) to linear movement along parallel axes. The first and second arms move along parallel first and second axes respectively, with a third axis providing vertical movement, creating a Cartesian coordinate system that simplifies the kinematics compared to traditional rotational approaches.
2Area of stationary object
If tool processes are stacked higher to reduce footprint, then area is reduced, but device complexity increases
Solution Approach 1:
The robot utilizes vertical movement along a third axis that is perpendicular to the first and second axes, enabling access to higher stacked process modules. This vertical dimension allows the robot to reach process modules at different heights without increasing the horizontal footprint, supporting the stacked configuration.
3Productivity
If more expensive robot components are used to achieve high throughput, then productivity is improved, but cost increases
Solution Approach 1:
The invention employs simpler, less expensive linear drive mechanisms rather than complex rotational actuators. The first and second drive mechanisms move arms along parallel axes with straightforward linear motion, reducing component costs while maintaining the capability for high-speed substrate handling and transfer operations.
Data Source
AI summary
A semiconductor processing system, a method of processing semiconductors, and a robot apparatus therefor. The robot apparatus may include: a support structure; a first arm having a first axis and being movably mounted to the support structure, the first arm having a first end effector and a second end effector; a second arm having a second axis and being movably mounted to the support structure, the second arm being spaced apart from the first arm, the second arm having a first end effector and a second end effector; a first drive mechanism configured to move the first arm along the first axis; a second drive mechanism configured to move the second arm along the second axis; and a third drive mechanism configured to move the first and second arms along a third axis that is perpendicular to the first and second axes.