Semiconductor Substrate Voids for Heat Dissipation
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Solution Overview
Problem
Integrated circuit dies face inefficiencies in heat dissipation due to semiconductor materials being poor heat conductors, limiting the transfer of heat generated by metal circuit layers through the substrate.
Innovation Solution
Creating integrated circuit dies with voids or slots in the substrate that extend from the bottom surface to an intermediate portion, and filling these voids with thermally conductive materials to enhance heat transfer, either using air or materials like graphene, graphite, or thermally conductive epoxies, which improve heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional semiconductor substrate is used, then structural integrity is maintained, but heat dissipation efficiency deteriorates
Solution Approach 1:
The substrate is segmented by creating voids or slots that divide the solid semiconductor material into separated regions. This segmentation increases the surface area available for heat transfer and allows insertion of materials with superior thermal conductivity, thereby improving heat dissipation while managing the structural complexity through controlled segmentation.
Solution Approach 2:
The invention employs composite structures by filling the voids or slots in the semiconductor substrate with materials that have higher thermal conductivity than the semiconductor material itself. This creates a composite system where the semiconductor substrate provides structural integrity while the inserted materials enhance heat dissipation, effectively resolving the contradiction between maintaining structure and improving thermal performance.
2Temperature
If voids are created in substrate, then heat transfer efficiency is improved, but mechanical strength deteriorates
Solution Approach 1:
The voids or slots are strategically positioned in specific regions of the substrate where heat generation is highest or where removal of material least compromises overall structural integrity. This local quality approach allows heat transfer efficiency to be improved in critical areas while maintaining sufficient mechanical strength in load-bearing regions, thus resolving the contradiction between enhanced heat transfer and preserved substrate strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly improves heat transfer efficiency through the IC die substrates, allowing for better heat dissipation compared to traditional semiconductor materials, especially in encapsulated integrated circuit packages.
Implementation Method 1
filling these voids with thermally conductive materials to enhance heat transfer
Data Source
AI summary
An integrated circuit device includes a semiconductor substrate with a top surface, a bottom surface opposite the top surface and an intermediate portion positioned between the top and bottom surfaces. The device also includes interior substrate surfaces defined by at least one void extending from the bottom surface to the intermediate portion.