Semiconductor Material Support for Power Module Thermal Management
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Solution Overview
Problem
The complex manufacturing process of electronic power modules involves multiple steps and materials, leading to thermomechanical stresses and inefficient thermal management due to the use of separate DCB substrates and cooling elements with different thermal expansion coefficients.
Innovation Solution
A semiconductor material support serves both as a substrate for mounting semiconductor components and a cooling element, reducing material complexity and thermomechanical stresses by eliminating the need for a separate DCB substrate and optimizing thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a separate DCB substrate and cooling element are used, then thermal management is achieved, but device complexity and manufacturing complexity increase
Solution Approach 1:
The patent combines the substrate and cooling element into a single integrated component made of semiconductor material. This merging eliminates the need for separate DCB substrate and cooling element, reducing device complexity while maintaining effective thermal management through the integrated structure's direct heat conduction path.
Solution Approach 2:
The semiconductor support performs multiple functions simultaneously: it serves as the mechanical substrate for mounting semiconductor components, as the electrical connection path, and as the cooling element for heat dissipation. This multi-functionality reduces the number of separate components needed while achieving comprehensive thermal management.
2Adaptability or versatility
If multiple materials with different thermal expansion coefficients are used, then functional requirements are met, but thermomechanical stresses increase
Solution Approach 1:
The patent uses a homogeneous semiconductor material for both the substrate and cooling element functions, eliminating the interfaces between materials with different thermal expansion coefficients. This homogeneity reduces thermomechanical stresses during temperature cycles while still meeting all functional requirements for mounting and heat dissipation.
Solution Approach 2:
The integrated semiconductor structure can be designed as a composite with optimized material properties, combining the mechanical strength needed for substrate function with the thermal conductivity required for cooling, while maintaining compatible thermal expansion characteristics throughout the structure to minimize stresses.
3Reliability
If a DCB substrate with copper layers is used, then electrical connection is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the electrical connection function into the semiconductor substrate itself, eliminating the need for separate copper bonding layers and DCB substrate manufacturing processes. This integration maintains reliable electrical connections through the semiconductor material while significantly simplifying the manufacturing process.
4Adaptability or versatility
If multiple layers with different materials are employed, then functional requirements are met, but thermal resistance increases
Solution Approach 1:
The patent combines the substrate and cooling element into a single integrated semiconductor component, eliminating the multiple material layers and interfaces that create thermal resistance. This integration creates a direct heat conduction path from the semiconductor component through the substrate to the cooling surface, minimizing thermal resistance while maintaining all necessary functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the construction of power modules, enhances service life, and improves thermal management by matching thermal expansion coefficients and reducing material layers, allowing for efficient heat dissipation and integration of additional electronic components.
Implementation Method 1
the support... serves, at the same time, as a cooling element
Data Source
AI summary
An electronic power module, including at least one semiconductor component, which is arranged on a support, as well as a cooling element, which is in thermal contact with the semiconductor component, wherein the support includes a semiconductor material and, at the same time, serves as a cooling element.