Semiconductor Package Support Structure for Reflow Tilt Control
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Solution Overview
Problem
In semiconductor device packages, the melting of solders during high-temperature processes can cause electronic components to tilt relative to the substrate, leading to incomplete electrical connections and adverse effects on performance, especially for components with tall and thin structures or central contacts.
Innovation Solution
A support structure is disposed between substrates, extending within the gap and partially under the electronic components to stabilize them during reflow, ensuring minimal tilt angles and maintaining electrical contact alignment, with the support structure later removed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solders are used to electrically connect electronic components to substrates, then electrical connection is achieved, but the solders may melt during high-temperature processes causing the electronic component to tilt
Solution Approach 1:
The support structure is disposed between the electronic component and the substrate before the reflow process, providing preliminary mechanical support to prevent tilting during the high-temperature process when solders melt. The support structure extends into the gap between substrates and is positioned to support the electronic component during the critical reflow stage.
Solution Approach 2:
The support structure acts as an intermediary element between the electronic component and the substrate, providing mechanical support during the reflow process. This intermediary structure prevents direct reliance on the solder joint for supporting the component weight, thereby preventing tilting while maintaining electrical connection functionality.
2Stability of the object's composition
If the support structure extends within the gap between substrates, then it provides effective support to prevent tilting, but it increases the complexity of the manufacturing process
Solution Approach 1:
The support structure is segmented to extend only partially into the gap between substrates, providing support where needed while maintaining manufacturability. The support structure is divided into portions that are disposed on substrates and portions that extend into the gap, allowing for standardized manufacturing processes.
Solution Approach 2:
The support structure's geometric parameters are optimized to provide adequate support while maintaining compatibility with existing manufacturing processes. The extension length into the gap, the width, and the height are carefully controlled to balance support effectiveness with manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly reduces tilt angles to less than 5 degrees, enhancing the yield rate of semiconductor device packages by maintaining stable electrical connections and preventing damage to components.
Implementation Method 1
A support structure is disposed between substrates, extending within the gap and partially under the electronic components to stabilize them during reflow
Implementation Method 2
the solders might be melted during high-temperature processes (e.g., the reflow process)
Data Source
AI summary
The present disclosure relates to a method of manufacturing a semiconductor device package. The method includes: (a) disposing a support structure on a first substrate; (b) electrically connecting a first electronic component on the first substrate, wherein a portion of the first electronic component is separated from the first substrate by the support structure; (c) heating the semiconductor device package; and (d) removing the support structure.